Vacuum beam studies of fluorocarbon radicals and argon ions on Si and SiO 2 surfaces

Yoshie Kimura, J. W. Coburn, David B. Graves

Research output: Contribution to journalArticlepeer-review

12 Scopus citations

Abstract

The use of fluorocarbon plasmas in semiconductors, thin film deposition and etching of Si and SiO 2 was analyzed. Investigations show that the molecules dissociatively adsorb at Si and SiO 2 surfaces in the presence of ion bombardment. It was found that signals attributed to heavier species leaving the surface drop significantly when ion bombardment was initiated and net etching was observed with the microbalance. It was concluded that ion bombardment increased the surface reaction probability of C xF y species.

Original languageEnglish (US)
Pages (from-to)2508-2516
Number of pages9
JournalJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Volume22
Issue number6
DOIs
StatePublished - Nov 2004
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films

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