Abstract
The use of fluorocarbon plasmas in semiconductors, thin film deposition and etching of Si and SiO 2 was analyzed. Investigations show that the molecules dissociatively adsorb at Si and SiO 2 surfaces in the presence of ion bombardment. It was found that signals attributed to heavier species leaving the surface drop significantly when ion bombardment was initiated and net etching was observed with the microbalance. It was concluded that ion bombardment increased the surface reaction probability of C xF y species.
Original language | English (US) |
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Pages (from-to) | 2508-2516 |
Number of pages | 9 |
Journal | Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films |
Volume | 22 |
Issue number | 6 |
DOIs | |
State | Published - Nov 2004 |
Externally published | Yes |
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Surfaces and Interfaces
- Surfaces, Coatings and Films