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TILE64™ processor: A 64-core SoC with mesh interconnect

  • Shane Bell
  • , Bruce Edwards
  • , John Amann
  • , Rich Conlin
  • , Kevin Joyce
  • , Vince Leung
  • , John MacKay
  • , Mike Reif
  • , Liewei Bao
  • , John Brown
  • , Matthew Mattina
  • , Chyi Chang Miao
  • , Carl Ramey
  • , David Wentzlaff
  • , Walker Anderson
  • , Ethan Berger
  • , Nat Fairbanks
  • , Durlov Khan
  • , Froilan Montenegro
  • , Jay Stickney
  • John Zook

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An SoC with 64 tiles connected by mesh networks for networking and multimedia markets is fabricated in 90nm CMOS. Each tile consists of a processor with a 3-way VLIW execution pipeline, memory management, cache, and a switch to manage communication to and from five independent on-chip networks. The chip provides up to 384GOPS with 240GB/S of on-chip bisectional bandwidth.

Original languageEnglish (US)
Title of host publication2008 IEEE International Solid State Circuits Conference - Digest of Technical Papers, ISSCC
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages87-89
Number of pages3
ISBN (Print)9781424420100
DOIs
StatePublished - 2008
Event2008 IEEE International Solid State Circuits Conference, ISSCC - San Francisco, CA, United States
Duration: Feb 3 2008Feb 7 2008

Publication series

NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume51
ISSN (Print)0193-6530

Other

Other2008 IEEE International Solid State Circuits Conference, ISSCC
Country/TerritoryUnited States
CitySan Francisco, CA
Period2/3/082/7/08

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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