Thin film transistors for foldable displays

E. Y. Ma; S. D. Theiss; M. H. Lu; C. C. Wu; J. C. Sturm; S. Wagner

Thin film transistors for foldable displays

E. Y. Ma, S. D. Theiss, M. H. Lu, C. C. Wu, J. C. Sturm, S. Wagner

Research output: Contribution to journal › Conference article › peer-review

Abstract

We report the first amorphous silicon thin film transistors (TFTs) on flexible, ultra-thin substrates of 25 μm thick stainless steel foil. The transistors remain operational under convex or concave bending down to 2.5 mm radius of curvature. The goal of our work is a transistor backplane circuit that can be folded, for use in active matrices in highly rugged and portable applications such as foldable intelligent maps. Our results suggest that such foldable backplane circuits are feasible.

Original language	English (US)
Pages (from-to)	535-538
Number of pages	4
Journal	Technical Digest - International Electron Devices Meeting, IEDM
State	Published - 1997
Event	1997 International Electron Devices Meeting - Washington, DC, USA Duration: Dec 7 1997 → Dec 10 1997

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

Cite this

@article{ea8902d4b29a43e192c46565aafa4478,

title = "Thin film transistors for foldable displays",

abstract = "We report the first amorphous silicon thin film transistors (TFTs) on flexible, ultra-thin substrates of 25 μm thick stainless steel foil. The transistors remain operational under convex or concave bending down to 2.5 mm radius of curvature. The goal of our work is a transistor backplane circuit that can be folded, for use in active matrices in highly rugged and portable applications such as foldable intelligent maps. Our results suggest that such foldable backplane circuits are feasible.",

author = "Ma, {E. Y.} and Theiss, {S. D.} and Lu, {M. H.} and Wu, {C. C.} and Sturm, {J. C.} and S. Wagner",

year = "1997",

language = "English (US)",

pages = "535--538",

journal = "Technical Digest - International Electron Devices Meeting, IEDM",

issn = "0163-1918",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "1997 International Electron Devices Meeting ; Conference date: 07-12-1997 Through 10-12-1997",

}

TY - JOUR

T1 - Thin film transistors for foldable displays

AU - Ma, E. Y.

AU - Theiss, S. D.

AU - Lu, M. H.

AU - Wu, C. C.

AU - Sturm, J. C.

AU - Wagner, S.

PY - 1997

Y1 - 1997

N2 - We report the first amorphous silicon thin film transistors (TFTs) on flexible, ultra-thin substrates of 25 μm thick stainless steel foil. The transistors remain operational under convex or concave bending down to 2.5 mm radius of curvature. The goal of our work is a transistor backplane circuit that can be folded, for use in active matrices in highly rugged and portable applications such as foldable intelligent maps. Our results suggest that such foldable backplane circuits are feasible.

AB - We report the first amorphous silicon thin film transistors (TFTs) on flexible, ultra-thin substrates of 25 μm thick stainless steel foil. The transistors remain operational under convex or concave bending down to 2.5 mm radius of curvature. The goal of our work is a transistor backplane circuit that can be folded, for use in active matrices in highly rugged and portable applications such as foldable intelligent maps. Our results suggest that such foldable backplane circuits are feasible.

UR - http://www.scopus.com/inward/record.url?scp=84886448015&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84886448015&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:84886448015

SN - 0163-1918

SP - 535

EP - 538

JO - Technical Digest - International Electron Devices Meeting, IEDM

JF - Technical Digest - International Electron Devices Meeting, IEDM

T2 - 1997 International Electron Devices Meeting

Y2 - 7 December 1997 through 10 December 1997

ER -

Thin film transistors for foldable displays

Abstract

All Science Journal Classification (ASJC) codes

Other files and links

Fingerprint

Cite this