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Thermal modeling, characterization and management of on-chip networks
Li Shang
, Li Shiuan Peh
, Amit Kumar
,
Niraj K. Jha
Electrical and Computer Engineering
Princeton Language and Intelligence (PLI)
Research output
:
Contribution to journal
›
Conference article
›
peer-review
153
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Scopus citations
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Keyphrases
Network on chip
100%
Thermal Modeling
100%
Thermal Management
100%
Thermal Characterization
100%
On chip
50%
Thermal Model
50%
Thermal Correlation
50%
Processing Element
50%
Thermal Impact
50%
Router
25%
Wire Delay
25%
System-on-chip
25%
Management Scheme
25%
Finite Element
25%
Increased Demand
25%
Power Density
25%
Delay Constraint
25%
Interconnect Fabric
25%
Cooling Cost
25%
Power Cooling
25%
Thermal Contribution
25%
On-chip Interconnects
25%
Impact Performance
25%
Thermal Safety
25%
Chip Temperature
25%
Power Measurement
25%
Thermal Profile
25%
Technology Demand
25%
Correlation-based
25%
Deep Submicron Technology
25%
CPU Thermal Management
25%
Element-based
25%
Computer Science
Networks on Chips
100%
Processing Element
50%
Thermal Management
50%
Thermal Profile
25%
Chip Temperature
25%
Network Bandwidth
25%
Delay Constraint
25%
Performance Impact
25%
Fabric Interconnect
25%
Finite Element Analysis
25%
System-on-Chip
25%
Collaboration
25%
Routers
25%
Engineering
Network-on-Chip
100%
Thermal Model
50%
Interconnects
50%
Thermal Impact
50%
Processing Element
50%
System-on-Chip
25%
Increasing Demand
25%
Power Density
25%
Delay Constraint
25%
Finite Element Analysis
25%
Accident Prevention
25%