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Thermal Conduction across Metal-Dielectric Sidewall Interfaces
Woosung Park
, Takashi Kodama
, Joonsuk Park
, Jungwan Cho
,
Aditya Sood
, Michael T. Barako
, Mehdi Asheghi
, Kenneth E. Goodson
Research output
:
Contribution to journal
›
Article
›
peer-review
9
Scopus citations
Overview
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Material Science
Dielectric Material
100%
Heat Resistance
100%
Nanocrystalline Material
66%
Thermal Analysis
33%
Silicon Dioxide
33%
Silicon
33%
Transistor
33%
Aluminum
33%
Carrier Transport
33%
Complementary Metal-Oxide-Semiconductor Device
33%
Keyphrases
Electro-thermal Method
10%
Incomplete Contacts
10%
Nanograting Structures
10%
Practical Devices
10%
Aluminum Dioxide
10%
Complex Nanostructures
10%
Under-etching
10%
Transmission Electron Micrograph
10%
Engineering
Principal Plane
10%