Thermal Conduction across Metal-Dielectric Sidewall Interfaces

Woosung Park, Takashi Kodama, Joonsuk Park, Jungwan Cho, Aditya Sood, Michael T. Barako, Mehdi Asheghi, Kenneth E. Goodson

Research output: Contribution to journalArticlepeer-review

9 Scopus citations

Fingerprint

Dive into the research topics of 'Thermal Conduction across Metal-Dielectric Sidewall Interfaces'. Together they form a unique fingerprint.

Material Science

Keyphrases

Engineering