The Simons Observatory: Production-Level Fabrication of the Mid- and Ultra-High-Frequency Wafers

  • Shannon M. Duff
  • , Jason Austermann
  • , James A. Beall
  • , David P. Daniel
  • , Johannes Hubmayr
  • , Greg C. Jaehnig
  • , Bradley R. Johnson
  • , Dante Jones
  • , Michael J. Link
  • , Tammy J. Lucas
  • , Rita F. Sonka
  • , Suzanne T. Staggs
  • , Joel Ullom
  • , Yuhan Wang

Research output: Contribution to journalArticlepeer-review

Abstract

The Simons Observatory (SO) is a cosmic microwave background instrumentation suite in the Atacama Desert of Chile. More than 65,000 polarization-sensitive transition-edge sensor (TES) bolometers will be fielded in the frequency range spanning 27 to 280 GHz, with three separate dichroic designs. The mid-frequency 90/150 GHz and ultra-high-frequency 220/280 GHz detector arrays, fabricated at NIST, account for 39 of 49 total detector modules and implement the feedhorn-fed orthomode transducer-coupled TES bolometer architecture. A robust production-level fabrication framework for these detector arrays and the monolithic DC/RF routing wafers has been developed, which includes single device prototyping, process monitoring techniques, in-process metrology, and cryogenic measurements of critical film properties. Application of this framework has resulted in timely delivery of nearly 100 total superconducting focal plane components to SO with 88% of detector wafers meeting nominal criteria for integration into a detector module: a channel yield >95% and Tc in the targeted range.

Original languageEnglish (US)
Pages (from-to)135-143
Number of pages9
JournalJournal of Low Temperature Physics
Volume216
Issue number1-2
DOIs
StatePublished - Jul 2024

All Science Journal Classification (ASJC) codes

  • Atomic and Molecular Physics, and Optics
  • General Materials Science
  • Condensed Matter Physics

Keywords

  • Bolometer
  • CMB
  • Microfabrication
  • Transition-edge sensor

Fingerprint

Dive into the research topics of 'The Simons Observatory: Production-Level Fabrication of the Mid- and Ultra-High-Frequency Wafers'. Together they form a unique fingerprint.

Cite this