The Heat Conduction Renaissance

Aditya Sood; Eric Pop; Mehdi Asheghi; Kenneth E. Goodson

doi:10.1109/ITHERM.2018.8419484

The Heat Conduction Renaissance

Aditya Sood, Eric Pop, Mehdi Asheghi, Kenneth E. Goodson

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

13 Scopus citations

Abstract

Some of the most exciting recent advancements in heat conduction physics have been motivated, enabled, or achieved by the thermal management community that ITherm serves so effectively. In this paper we highlight the resulting renaissance in basic heat conduction research, which is linked to cooling challenges from power transistors to portables. Examples include phonon transport and scattering in nanotransistors, engineered high-conductivity composites, modulated conductivity through phase transitions, as well as the surprising transport properties of low-dimensional (1D and 2D) nanomaterials. This work benefits strongly from decades of collaboration and leadership from the semiconductor industry.

Original language	English (US)
Title of host publication	Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1396-1402
Number of pages	7
ISBN (Electronic)	9781538612729
DOIs	https://doi.org/10.1109/ITHERM.2018.8419484
State	Published - Jul 24 2018
Externally published	Yes
Event	17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018 - San Diego, United States Duration: May 29 2018 → Jun 1 2018

Publication series

Name	Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018

Conference

Conference	17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018
Country/Territory	United States
City	San Diego
Period	5/29/18 → 6/1/18

All Science Journal Classification (ASJC) codes

Fluid Flow and Transfer Processes
Electrical and Electronic Engineering
Mechanics of Materials
Safety, Risk, Reliability and Quality

Access to Document

10.1109/ITHERM.2018.8419484

Cite this

Sood, A., Pop, E., Asheghi, M., & Goodson, K. E. (2018). The Heat Conduction Renaissance. In Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018 (pp. 1396-1402). Article 8419484 (Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ITHERM.2018.8419484

Sood, Aditya ; Pop, Eric ; Asheghi, Mehdi et al. / The Heat Conduction Renaissance. Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 1396-1402 (Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018).

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title = "The Heat Conduction Renaissance",

abstract = "Some of the most exciting recent advancements in heat conduction physics have been motivated, enabled, or achieved by the thermal management community that ITherm serves so effectively. In this paper we highlight the resulting renaissance in basic heat conduction research, which is linked to cooling challenges from power transistors to portables. Examples include phonon transport and scattering in nanotransistors, engineered high-conductivity composites, modulated conductivity through phase transitions, as well as the surprising transport properties of low-dimensional (1D and 2D) nanomaterials. This work benefits strongly from decades of collaboration and leadership from the semiconductor industry.",

author = "Aditya Sood and Eric Pop and Mehdi Asheghi and Goodson, {Kenneth E.}",

note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018 ; Conference date: 29-05-2018 Through 01-06-2018",

year = "2018",

month = jul,

day = "24",

doi = "10.1109/ITHERM.2018.8419484",

language = "English (US)",

series = "Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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Sood, A, Pop, E, Asheghi, M & Goodson, KE 2018, The Heat Conduction Renaissance. in Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018., 8419484, Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018, Institute of Electrical and Electronics Engineers Inc., pp. 1396-1402, 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018, San Diego, United States, 5/29/18. https://doi.org/10.1109/ITHERM.2018.8419484

The Heat Conduction Renaissance. / Sood, Aditya; Pop, Eric; Asheghi, Mehdi et al.
Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1396-1402 8419484 (Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AB - Some of the most exciting recent advancements in heat conduction physics have been motivated, enabled, or achieved by the thermal management community that ITherm serves so effectively. In this paper we highlight the resulting renaissance in basic heat conduction research, which is linked to cooling challenges from power transistors to portables. Examples include phonon transport and scattering in nanotransistors, engineered high-conductivity composites, modulated conductivity through phase transitions, as well as the surprising transport properties of low-dimensional (1D and 2D) nanomaterials. This work benefits strongly from decades of collaboration and leadership from the semiconductor industry.

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Sood A, Pop E, Asheghi M, Goodson KE. The Heat Conduction Renaissance. In Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018. Institute of Electrical and Electronics Engineers Inc. 2018. p. 1396-1402. 8419484. (Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018). doi: 10.1109/ITHERM.2018.8419484

The Heat Conduction Renaissance

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All Science Journal Classification (ASJC) codes

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