The effect of VUV radiation from Ar/O₂ plasmas on low-k SiOCH films

Engineering

• Dielectrics 100%
• Fourier Transform 66%
• Hydrophilicity 33%
• Penetration Depth 33%
• Model Prediction 33%
• Integrated Circuit 33%
• Dynamic Behavior 33%
• Exposure Time 33%
• Fitting Parameter 33%
• Plasma Treatment 33%
• Plasma Applications 33%
• Induced Damage 33%
• Ar Plasma 33%

Material Science

• Film 100%
• Permittivity 66%
• Lamp 66%
• Dielectric Material 33%
• Electronic Circuit 33%
• Fourier Transform Infrared Spectroscopy 33%

Keyphrases

• SiOCH 100%
• Ar/O2 Plasma 100%
• Porous Low-k Material 12%
• Xe-lamp 12%
• Mercury Probe 12%
• Fourier Transform Infrared Analysis 12%
• Vacuum Ultraviolet Absorption 12%
• Vacuum Ultraviolet Lamp 12%