TY - GEN
T1 - Terahertz Chip-scale Systems
AU - Sengupta, Kaushik
AU - Saeidi, Hooman
AU - Lu, Xuyang
AU - Venkatesh, Suresh
AU - Wu, Xue
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/12
Y1 - 2020/12
N2 - In this paper, we highlight the advances in chip-scale technologies in the terahertz spectrum between 100 GHz and 10 THz, particularly focusing on silicon-based integrated chip technology that can have a transformative impact in wireless communication, sensing and imaging.
AB - In this paper, we highlight the advances in chip-scale technologies in the terahertz spectrum between 100 GHz and 10 THz, particularly focusing on silicon-based integrated chip technology that can have a transformative impact in wireless communication, sensing and imaging.
UR - http://www.scopus.com/inward/record.url?scp=85101162123&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85101162123&partnerID=8YFLogxK
U2 - 10.1109/ECOC48923.2020.9333156
DO - 10.1109/ECOC48923.2020.9333156
M3 - Conference contribution
AN - SCOPUS:85101162123
T3 - 2020 European Conference on Optical Communications, ECOC 2020
BT - 2020 European Conference on Optical Communications, ECOC 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 46th European Conference on Optical Communications, ECOC 2020
Y2 - 6 December 2020 through 10 December 2020
ER -