Terahertz Chip-scale Systems

Kaushik Sengupta; Hooman Saeidi; Xuyang Lu; Suresh Venkatesh; Xue Wu

doi:10.1109/ECOC48923.2020.9333156

Terahertz Chip-scale Systems

Kaushik Sengupta, Hooman Saeidi, Xuyang Lu, Suresh Venkatesh, Xue Wu

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Scopus citations

Abstract

In this paper, we highlight the advances in chip-scale technologies in the terahertz spectrum between 100 GHz and 10 THz, particularly focusing on silicon-based integrated chip technology that can have a transformative impact in wireless communication, sensing and imaging.

Original language	English (US)
Title of host publication	2020 European Conference on Optical Communications, ECOC 2020
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781728173610
DOIs	https://doi.org/10.1109/ECOC48923.2020.9333156
State	Published - Dec 2020
Externally published	Yes
Event	46th European Conference on Optical Communications, ECOC 2020 - Virtual, Brussels, Belgium Duration: Dec 6 2020 → Dec 10 2020

Publication series

Name	2020 European Conference on Optical Communications, ECOC 2020

Conference

Conference	46th European Conference on Optical Communications, ECOC 2020
Country/Territory	Belgium
City	Virtual, Brussels
Period	12/6/20 → 12/10/20

All Science Journal Classification (ASJC) codes

Computer Networks and Communications
Electronic, Optical and Magnetic Materials
Instrumentation
Atomic and Molecular Physics, and Optics

Access to Document

10.1109/ECOC48923.2020.9333156

Cite this

@inproceedings{6e38eb81c46846c4a0fda80cbbfaf8a6,

title = "Terahertz Chip-scale Systems",

abstract = "In this paper, we highlight the advances in chip-scale technologies in the terahertz spectrum between 100 GHz and 10 THz, particularly focusing on silicon-based integrated chip technology that can have a transformative impact in wireless communication, sensing and imaging.",

author = "Kaushik Sengupta and Hooman Saeidi and Xuyang Lu and Suresh Venkatesh and Xue Wu",

note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 46th European Conference on Optical Communications, ECOC 2020 ; Conference date: 06-12-2020 Through 10-12-2020",

year = "2020",

month = dec,

doi = "10.1109/ECOC48923.2020.9333156",

language = "English (US)",

series = "2020 European Conference on Optical Communications, ECOC 2020",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2020 European Conference on Optical Communications, ECOC 2020",

address = "United States",

}

Sengupta, K, Saeidi, H, Lu, X, Venkatesh, S & Wu, X 2020, Terahertz Chip-scale Systems. in 2020 European Conference on Optical Communications, ECOC 2020., 9333156, 2020 European Conference on Optical Communications, ECOC 2020, Institute of Electrical and Electronics Engineers Inc., 46th European Conference on Optical Communications, ECOC 2020, Virtual, Brussels, Belgium, 12/6/20. https://doi.org/10.1109/ECOC48923.2020.9333156

Terahertz Chip-scale Systems. / Sengupta, Kaushik; Saeidi, Hooman; Lu, Xuyang et al.
2020 European Conference on Optical Communications, ECOC 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9333156 (2020 European Conference on Optical Communications, ECOC 2020).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Terahertz Chip-scale Systems

AU - Sengupta, Kaushik

AU - Saeidi, Hooman

AU - Lu, Xuyang

AU - Venkatesh, Suresh

AU - Wu, Xue

PY - 2020/12

Y1 - 2020/12

N2 - In this paper, we highlight the advances in chip-scale technologies in the terahertz spectrum between 100 GHz and 10 THz, particularly focusing on silicon-based integrated chip technology that can have a transformative impact in wireless communication, sensing and imaging.

AB - In this paper, we highlight the advances in chip-scale technologies in the terahertz spectrum between 100 GHz and 10 THz, particularly focusing on silicon-based integrated chip technology that can have a transformative impact in wireless communication, sensing and imaging.

UR - http://www.scopus.com/inward/record.url?scp=85101162123&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85101162123&partnerID=8YFLogxK

U2 - 10.1109/ECOC48923.2020.9333156

DO - 10.1109/ECOC48923.2020.9333156

M3 - Conference contribution

AN - SCOPUS:85101162123

T3 - 2020 European Conference on Optical Communications, ECOC 2020

BT - 2020 European Conference on Optical Communications, ECOC 2020

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 46th European Conference on Optical Communications, ECOC 2020

Y2 - 6 December 2020 through 10 December 2020

ER -

Terahertz Chip-scale Systems

Abstract

Publication series

Conference

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this