Abstract
The infrared transmission technique for the measurement of silicon wafer temperature has been extended to metallized wafers. For wafers with partial metal coverage, a single-pass method has been demonstrated from 200°C to 550°C. For wafers with blanket metal coverage, a novel double-pass infrared transmission technique is presented.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 23-28 |
| Number of pages | 6 |
| Journal | Materials Research Society Symposium - Proceedings |
| Volume | 342 |
| DOIs | |
| State | Published - 1994 |
| Event | Proceedings of the 1994 Spring Meeting of the Materials Research Society - San Francisco, CA, USA Duration: Apr 4 1994 → Apr 7 1994 |
All Science Journal Classification (ASJC) codes
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering