Temperature-aware on-chip networks

Shang Li, Li Shiuan Peh, Amit Kumar, Niraj K. Jha

Research output: Contribution to journalArticle

27 Scopus citations

Abstract

On-chip networks are becoming increasingly popular as a way to connect high-performance single-chip computer systems, but thermal issues greatly limit network design. This thermal modeling and simulation framework combines with a distributed runtime scheme for thermal management to offer a path to thermally efficient on-chip network design.

Original languageEnglish (US)
Pages (from-to)130-139
Number of pages10
JournalIEEE Micro
Volume26
Issue number1
DOIs
StatePublished - Jan 1 2006

All Science Journal Classification (ASJC) codes

  • Software
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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