Engineering & Materials Science
Low-k dielectric
100%
Dielectric films
99%
Photons
79%
Vacuum
59%
Plasmas
53%
Ion bombardment
30%
Permittivity
28%
Dangling bonds
17%
Ultraviolet lamps
16%
Plasma applications
15%
Beam plasma interactions
15%
Surface reactions
13%
Mass spectrometry
12%
Fourier transform infrared spectroscopy
11%
Water vapor
10%
Adsorption
9%
Heating
6%
Chemical Compounds
Dielectric Film
98%
Photon
64%
Vacuum
53%
Dielectric Constant
26%
Ion Bombardment
25%
Plasma
17%
Dangling Bond
12%
Silanol
10%
Surface Reaction
10%
Water Vapor
9%
Dielectric Material
8%
Mass Spectrometry
6%
Porosity
5%
Fourier Transform Infrared Spectroscopy
5%
Adsorption
4%
Liquid Film
4%
Physics & Astronomy
damage
48%
vacuum
42%
photons
37%
permittivity
20%
surface reactions
19%
bombardment
17%
photon beams
10%
attack
10%
water vapor
9%
mass spectroscopy
9%
luminaires
9%
ions
8%
diffusivity
8%
infrared spectroscopy
8%
fluence
8%
adsorption
7%
atmospheres
6%
heating
6%