Sub-10-nm wide trench, line, and hole fabrication using pressed self-perfection

Ying Wang, Xiaogan Liang, Yixing Liang, Stephen Y. Chou

Research output: Contribution to journalArticle

26 Scopus citations

Abstract

We report a new approach to adjust and improve nanostructures after their initial fabrication, which can reduce the trench width and hole diameter to sub-10 nm, while smoothing edge roughness and perfecting pattern shapes. In this method, termed pressed self-perfection by liquefaction (P-SPEL), a flat guiding plate is pressed on top of the structures (which are soften or molten transiently) on a substrate to reduce their height and guide the flow of the materials into the desired geometry before hardening. P-SPEL results in smaller spacing between two structures or smaller holes in a thin film.

Original languageEnglish (US)
Pages (from-to)1986-1990
Number of pages5
JournalNano Letters
Volume8
Issue number7
DOIs
StatePublished - Jul 1 2008

All Science Journal Classification (ASJC) codes

  • Bioengineering
  • Chemistry(all)
  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering

Fingerprint Dive into the research topics of 'Sub-10-nm wide trench, line, and hole fabrication using pressed self-perfection'. Together they form a unique fingerprint.

Cite this