Stretchable and deformable macroelectronics

S. Wagner, S. P. Lacour, P. H.I. Hsu, J. C. Sturm, Z. Suo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

In this paper explained about the fabrication and evolution of integrated circuit. Here focusses an electronic skin and its components: the thin film, transistor backplane, the chemical sensor functional frontplane, and the computation and communication network. To date most work has gone into the backplane, some into exploring new functions., and little into circuit and network architectures.

Original languageEnglish (US)
Title of host publication61st Device Research Conference, DRC 2003 - Conference Digest
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages195-197
Number of pages3
ISBN (Electronic)0780377273
DOIs
StatePublished - Jan 1 2003
Event61st Device Research Conference, DRC 2003 - Salt Lake City, United States
Duration: Jun 23 2003Jun 25 2003

Publication series

NameDevice Research Conference - Conference Digest, DRC
Volume2003-January
ISSN (Print)1548-3770

Other

Other61st Device Research Conference, DRC 2003
CountryUnited States
CitySalt Lake City
Period6/23/036/25/03

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Keywords

  • Backplanes
  • Chemical sensors
  • Communication networks
  • Computer architecture
  • Computer networks
  • Fabrication
  • Skin
  • Thin film circuits
  • Thin film sensors
  • Thin film transistors

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  • Cite this

    Wagner, S., Lacour, S. P., Hsu, P. H. I., Sturm, J. C., & Suo, Z. (2003). Stretchable and deformable macroelectronics. In 61st Device Research Conference, DRC 2003 - Conference Digest (pp. 195-197). [1226929] (Device Research Conference - Conference Digest, DRC; Vol. 2003-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/DRC.2003.1226929