Stress-intensity factors for surface cracks in functionally graded materials under mode-I thermomechanical loading

Matthew C. Walters, Glaucio H. Paulino, Robert H. Dodds

Research output: Contribution to journalArticlepeer-review

137 Scopus citations


This paper describes the development and application of a general domain integral method to obtain J-values along crack fronts in three-dimensional configurations of isotropic, functionally graded materials (FGMs). The present work considers mode-I, linear-elastic response of cracked specimens subjected to thermomechanical loading, although the domain integral formulation accommodates elastic-plastic behavior in FGMs. Finite element solutions and domain integral J-values for a two-dimensional edge crack show good agreement with available analytical solutions for both tension loading and temperature gradients. A displacement correlation technique provides pointwise stress-intensity values along semi-elliptical surface cracks in FGMs for comparison with values derived from the proposed domain integral. Numerical implementation and mesh refinement issues to maintain path independent J-values are explored. The paper concludes with a parametric study that provides a set of stress-intensity factors for semi-elliptical surface cracks covering a practical range of crack sizes, aspect ratios and material property gradations under tension, bending and spatially-varying temperature loads.

Original languageEnglish (US)
Pages (from-to)1081-1118
Number of pages38
JournalInternational Journal of Solids and Structures
Issue number3-4
StatePublished - Feb 2004
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Modeling and Simulation
  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Applied Mathematics


  • Domain integral
  • Functionally graded material
  • J-integral
  • Mode-I stress-intensity factor
  • Semi-elliptical surface crack
  • Three dimensions


Dive into the research topics of 'Stress-intensity factors for surface cracks in functionally graded materials under mode-I thermomechanical loading'. Together they form a unique fingerprint.

Cite this