Abstract
In this work, local AFM oxidation technique in a controlled humidity environment has been used to create small features in strained SiGe alloys. When directly oxidizing SiGe alloys, minimum line widths of 20nm were achieved by adjusting parameters such as the bias voltage on the microscope tip and the tip writing speed. It was found that when bias voltage increases, and/or when the tip writing speed decreases, the oxidation height of silicon-germanium increases. In contrast to conventional thermal oxidation, the oxide height on SiGe alloys is slightly less than that on Si. Finally, this method was used to successfully cut conducting SiGe quantum well lines with high resolution.
Original language | English (US) |
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Pages (from-to) | 173-178 |
Number of pages | 6 |
Journal | Materials Research Society Symposium - Proceedings |
Volume | 686 |
State | Published - 2002 |
Event | Materials Issues in Novel Si-Based Technology - Boston, MA, United States Duration: Nov 26 2001 → Nov 28 2001 |
All Science Journal Classification (ASJC) codes
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering