TY - CHAP
T1 - Sensing Sheets Based on Large-Area Electronics and Integrated Circuits
AU - Glisic, Branko
AU - Verma, Naveen
N1 - Funding Information:
The research on LAE/IC sensing sheets was in part supported by the Princeton Institute for the Science and Technology of Materials (PRISM), Princeton's Keller Center, and USDOT-RITA UTC Program grants Nos. DTRT12-G-UTC16 and DTRT13-G-UTC28, enabled through the Center for Advanced Infrastructure and Transportation (CAIT) at Rutgers University.
Publisher Copyright:
© 2016 Elsevier Ltd. All rights reserved.
PY - 2016
Y1 - 2016
N2 - Accurate and reliable early-stage identification of damage requires pervasive deployment of sensors in the critical areas of structures. Deployment of dense arrays of sensors enhances the probability that damage will directly affect the sensors and result in discernable output signals. However, the deployment of currently available sensors in the form of dense arrays over large areas represents a major challenge in terms of costs, complexity of installation, and data management. Consequently, new technological breakthroughs are needed. Large-area electronics (LAE) is an emerging technology that, combined with integrated circuits (ICs), has potential to enable the formation of practical and scalable dense sensor arrays in the form factor of a thin sensing sheet. The sensing sheet consists of a dense array of strain sensors patterned on a flexible substrate, as well as the electronics for strain readout, full-system self-powering, and communication. This chapter introduces LAE and IC technologies and presents several stages in the development of such sensing sheets.
AB - Accurate and reliable early-stage identification of damage requires pervasive deployment of sensors in the critical areas of structures. Deployment of dense arrays of sensors enhances the probability that damage will directly affect the sensors and result in discernable output signals. However, the deployment of currently available sensors in the form of dense arrays over large areas represents a major challenge in terms of costs, complexity of installation, and data management. Consequently, new technological breakthroughs are needed. Large-area electronics (LAE) is an emerging technology that, combined with integrated circuits (ICs), has potential to enable the formation of practical and scalable dense sensor arrays in the form factor of a thin sensing sheet. The sensing sheet consists of a dense array of strain sensors patterned on a flexible substrate, as well as the electronics for strain readout, full-system self-powering, and communication. This chapter introduces LAE and IC technologies and presents several stages in the development of such sensing sheets.
KW - CMOS integrated circuits
KW - Civil structures and infrastructure
KW - Damage detection and characterization
KW - Large-area electronics
KW - Strain sensing sheet
KW - Structural health monitoring
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U2 - 10.1016/B978-1-78242-326-3.00012-9
DO - 10.1016/B978-1-78242-326-3.00012-9
M3 - Chapter
AN - SCOPUS:84967185852
SN - 9781782423263
SP - 281
EP - 302
BT - Innovative Developments of Advanced Multifunctional Nanocomposites in Civil and Structural Engineering
PB - Elsevier Inc.
ER -