Sensing Sheets Based on Large-Area Electronics and Integrated Circuits

Research output: Chapter in Book/Report/Conference proceedingChapter

1 Scopus citations

Abstract

Accurate and reliable early-stage identification of damage requires pervasive deployment of sensors in the critical areas of structures. Deployment of dense arrays of sensors enhances the probability that damage will directly affect the sensors and result in discernable output signals. However, the deployment of currently available sensors in the form of dense arrays over large areas represents a major challenge in terms of costs, complexity of installation, and data management. Consequently, new technological breakthroughs are needed. Large-area electronics (LAE) is an emerging technology that, combined with integrated circuits (ICs), has potential to enable the formation of practical and scalable dense sensor arrays in the form factor of a thin sensing sheet. The sensing sheet consists of a dense array of strain sensors patterned on a flexible substrate, as well as the electronics for strain readout, full-system self-powering, and communication. This chapter introduces LAE and IC technologies and presents several stages in the development of such sensing sheets.

Original languageEnglish (US)
Title of host publicationInnovative Developments of Advanced Multifunctional Nanocomposites in Civil and Structural Engineering
PublisherElsevier Inc.
Pages281-302
Number of pages22
ISBN (Electronic)9781782423447
ISBN (Print)9781782423263
DOIs
StatePublished - Jan 1 2016

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Keywords

  • CMOS integrated circuits
  • Civil structures and infrastructure
  • Damage detection and characterization
  • Large-area electronics
  • Strain sensing sheet
  • Structural health monitoring

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  • Cite this

    Glisic, B., & Verma, N. (2016). Sensing Sheets Based on Large-Area Electronics and Integrated Circuits. In Innovative Developments of Advanced Multifunctional Nanocomposites in Civil and Structural Engineering (pp. 281-302). Elsevier Inc.. https://doi.org/10.1016/B978-1-78242-326-3.00012-9