Abstract
We fabricated the first bottom-gate amorphous silicon (a-Si:H) thin-film transistors (TFTs) on a clear plastic substrate with source and drain self-aligned to the gate. The top source and drain are self-aligned to the bottom gate by backside exposure photolithography through the plastic substrate and the TFT tri-layer. The a-Si:H channel in the tri-layer is made only 30 nm thick to ensure high optical transparency at the exposure wavelength of 405 nm. The TFTs have a threshold voltage of ∼3 V, subthreshold slope of ∼0.5 V/dec, linear mobility of ∼1cm2V-1 S-1, saturation mobility of ∼0.8 cm2V-1 S-1 and on/off current ratio of >106. These results show that self-alignment by backside exposure provides a solution to the fundamental challenge of making electronics on plastics: overlay misalignment.
Original language | English (US) |
---|---|
Pages (from-to) | 166-168 |
Number of pages | 3 |
Journal | IEEE Electron Device Letters |
Volume | 27 |
Issue number | 3 |
DOIs | |
State | Published - Mar 2006 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering
Keywords
- Amorphous-silicon (a-Si:H)
- Plastic substrates
- Self-aligned process
- Thin-film transistors (TFTs)