TY - GEN
T1 - Seizing the Bandwidth Scaling of On-Package Interconnect in a Post-Moore's Law World
AU - Chirkov, Grigory
AU - Wentzlaff, David
N1 - Funding Information:
We would like to thank Ang Li, Rohan Prabhakar, August Ning, Marcelo Orenes-Vera, Alexey Lavrov, Jonathan Balkind, Georgios Tziantzioulis, Ting-Jung Chang, and anonymous reviewers for their valuable feedback. This material is based on research sponsored by the National Science Foundation under Grant No. CCF-1822949, Air Force Research Laboratory (AFRL) and Defense Advanced Research Projects Agency (DARPA) under agreement No. FA8650-18-2-7862. The U.S. Government is authorized to reproduce and distribute reprints for Governmental purposes notwithstanding any copyright notation thereon. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of Air Force Research Laboratory (AFRL) and Defense Advanced Research Projects Agency (DARPA) or the U.S. Government. Any opinions, findings, and conclusions or recommendations expressed in this material are those of the authors and do not necessarily reflect the views of the National Science Foundation.
Publisher Copyright:
© 2023 Owner/Author(s).
PY - 2023/6/21
Y1 - 2023/6/21
N2 - The slowing and forecasted end of Moore's Law have forced designers to look beyond simply adding transistors, encouraging them to employ other unused resources as a manner to increase chip performance. At the same time, in recent years, inter-die interconnect technologies made a huge leap forward, dramatically increasing the available bandwidth. While the end of Moore's Law will inevitably slow down the performance advances of single-die setups, interconnect technologies will likely continue to scale. We envision a future where designers must create ways to exploit interconnect utilization for better system performance.As an example of a feature that converts interconnect utilization into performance, we present Meduza - a write-update coherence protocol for future chiplet systems. Meduza extends previous write-update protocols to systems with multi-level cache hierarchies. Meduza improves execution speed in our benchmark suite by 19% when compared to the MESIF coherence protocol on a chiplet-based system. Moreover, Meduza promises even more advantages in future systems. This work shows that by exploiting excess interconnect bandwidth, there is significant potential for additional performance in modern and future chiplet systems.
AB - The slowing and forecasted end of Moore's Law have forced designers to look beyond simply adding transistors, encouraging them to employ other unused resources as a manner to increase chip performance. At the same time, in recent years, inter-die interconnect technologies made a huge leap forward, dramatically increasing the available bandwidth. While the end of Moore's Law will inevitably slow down the performance advances of single-die setups, interconnect technologies will likely continue to scale. We envision a future where designers must create ways to exploit interconnect utilization for better system performance.As an example of a feature that converts interconnect utilization into performance, we present Meduza - a write-update coherence protocol for future chiplet systems. Meduza extends previous write-update protocols to systems with multi-level cache hierarchies. Meduza improves execution speed in our benchmark suite by 19% when compared to the MESIF coherence protocol on a chiplet-based system. Moreover, Meduza promises even more advantages in future systems. This work shows that by exploiting excess interconnect bandwidth, there is significant potential for additional performance in modern and future chiplet systems.
KW - bandwidth
KW - coherence
KW - interconnect
KW - multi-chiplet
KW - multicore
KW - scaling
KW - write-update
UR - http://www.scopus.com/inward/record.url?scp=85168416254&partnerID=8YFLogxK
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U2 - 10.1145/3577193.3593702
DO - 10.1145/3577193.3593702
M3 - Conference contribution
AN - SCOPUS:85168416254
T3 - Proceedings of the International Conference on Supercomputing
SP - 410
EP - 422
BT - ACM ICS 2023 - Proceedings of the International Conference on Supercomputing
PB - Association for Computing Machinery
T2 - 37th ACM International Conference on Supercomputing, ICS 2023
Y2 - 21 June 2023 through 23 June 2023
ER -