Role of metal-molecule chemistry and interdiffusion on the electrical properties of an organic interface: The Al-F16CuPc case

Chongfei Shen; Antoine Kahn; Jeffrey Schwartz

doi:10.1063/1.1419263

Role of metal-molecule chemistry and interdiffusion on the electrical properties of an organic interface: The Al-F₁₆CuPc case

Chongfei Shen, Antoine Kahn, Jeffrey Schwartz

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Abstract

The chemistry and electronic structure of interfaces between Al and copper hexadecafluorophthalocyanine (F₁₆CuPc) are studied via x-ray photoemission spectroscopy, ultraviolet photoemission spectroscopy (UPS), and current-voltage measurements. Electron injection barriers measured by UPS are reported. Analysis of the Al-F₁₆CuPc reaction shows the formation of a phase of three-dimensional (F₁₆CuPc)₃Al species. The reacted region is extended at the Al-on-F₁₆CuPc interface and narrow at the F₁₆CuPc-on-Al interface. A series of metal/F₁₆CuPc/metal structures is fabricated to study the impact of the interface chemistry and deposition sequence on device performances. It is found that (F₁₆CuPc)₃Al forms a low conductivity region, which has considerable bearing on the electron current. The interface fabrication sequence, which defines the thickness of the reacted region, therefore has a profound impact on device performance.

Original language	English (US)
Pages (from-to)	6236-6242
Number of pages	7
Journal	Journal of Applied Physics
Volume	90
Issue number	12
DOIs	https://doi.org/10.1063/1.1419263
State	Published - Dec 15 2001

All Science Journal Classification (ASJC) codes

General Physics and Astronomy

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10.1063/1.1419263

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title = "Role of metal-molecule chemistry and interdiffusion on the electrical properties of an organic interface: The Al-F16CuPc case",

abstract = "The chemistry and electronic structure of interfaces between Al and copper hexadecafluorophthalocyanine (F16CuPc) are studied via x-ray photoemission spectroscopy, ultraviolet photoemission spectroscopy (UPS), and current-voltage measurements. Electron injection barriers measured by UPS are reported. Analysis of the Al-F16CuPc reaction shows the formation of a phase of three-dimensional (F16CuPc)3Al species. The reacted region is extended at the Al-on-F16CuPc interface and narrow at the F16CuPc-on-Al interface. A series of metal/F16CuPc/metal structures is fabricated to study the impact of the interface chemistry and deposition sequence on device performances. It is found that (F16CuPc)3Al forms a low conductivity region, which has considerable bearing on the electron current. The interface fabrication sequence, which defines the thickness of the reacted region, therefore has a profound impact on device performance.",

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T1 - Role of metal-molecule chemistry and interdiffusion on the electrical properties of an organic interface

T2 - The Al-F16CuPc case

AU - Shen, Chongfei

AU - Kahn, Antoine

AU - Schwartz, Jeffrey

PY - 2001/12/15

Y1 - 2001/12/15

N2 - The chemistry and electronic structure of interfaces between Al and copper hexadecafluorophthalocyanine (F16CuPc) are studied via x-ray photoemission spectroscopy, ultraviolet photoemission spectroscopy (UPS), and current-voltage measurements. Electron injection barriers measured by UPS are reported. Analysis of the Al-F16CuPc reaction shows the formation of a phase of three-dimensional (F16CuPc)3Al species. The reacted region is extended at the Al-on-F16CuPc interface and narrow at the F16CuPc-on-Al interface. A series of metal/F16CuPc/metal structures is fabricated to study the impact of the interface chemistry and deposition sequence on device performances. It is found that (F16CuPc)3Al forms a low conductivity region, which has considerable bearing on the electron current. The interface fabrication sequence, which defines the thickness of the reacted region, therefore has a profound impact on device performance.

AB - The chemistry and electronic structure of interfaces between Al and copper hexadecafluorophthalocyanine (F16CuPc) are studied via x-ray photoemission spectroscopy, ultraviolet photoemission spectroscopy (UPS), and current-voltage measurements. Electron injection barriers measured by UPS are reported. Analysis of the Al-F16CuPc reaction shows the formation of a phase of three-dimensional (F16CuPc)3Al species. The reacted region is extended at the Al-on-F16CuPc interface and narrow at the F16CuPc-on-Al interface. A series of metal/F16CuPc/metal structures is fabricated to study the impact of the interface chemistry and deposition sequence on device performances. It is found that (F16CuPc)3Al forms a low conductivity region, which has considerable bearing on the electron current. The interface fabrication sequence, which defines the thickness of the reacted region, therefore has a profound impact on device performance.

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Role of metal-molecule chemistry and interdiffusion on the electrical properties of an organic interface: The Al-F₁₆CuPc case

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