Abstract
Sub-50 nm high aspect-ratio pillars, ridges, and trenches have been patterned in Si and SiGe using reactive ion etching (RIE) with Cr masks defined by ultra-high resolution electron beam lithography and a lift-off process. Using an optimized mixture of Cl2 and SiCl4 gases, sub-50 nm features with aspect ratios greater than 10 were readily and consistently achieved. For achieving similar nanostructures in SiGe, an identical gas mixture at lower pressures is required.
Original language | English (US) |
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Pages (from-to) | 311-314 |
Number of pages | 4 |
Journal | Microelectronic Engineering |
Volume | 21 |
Issue number | 1-4 |
DOIs | |
State | Published - Apr 1993 |
Externally published | Yes |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Electrical and Electronic Engineering