Reconfigurable Intelligent Surfaces Enabled by Silicon Chips for Secure and Robust mmWave and THz Wireless Communication

Kaushik Sengupta, Suresh Venkatesh, Hooman Saeidi, Xuyang Lu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The initial deployment of 5G millimeter-Wave (mmWave) networks have shown that while they can sustain Gb/s wireless links with spatial multiplexing at low latencies, they are also highly susceptible to blockages, channel disruptions, and fading due to the nature of their directive beams. Robust mmWave coverage requires high densification of base stations that is prohibitively expensive and complex. Reconfigurable intelligent surfaces (RISs) have emerged as a technology to allow smart reconfiguration of the radio propagation environment by creating more favorable transmission characteristics. Constituted as an array of reconfigurable scattering or antenna elements, such passive surface (with near zero DC power consumption) are scalable and widely deployable. Traditionally referred to as reflect/transmit arrays in the microwave community, these arrays, when combined with silicon ICs in their new avatar, can now allow frequency scaling into the mmWave/THz, rapid programmability, scalability, amplification on-demand (for active surfaces), and sensing. Here, we present the case for such surfaces, design challenges, recent state-of-The-Art work, and their impact for future wireless networks.

Original languageEnglish (US)
Title of host publicationESSCIRC 2022 - IEEE 48th European Solid State Circuits Conference, Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages546-549
Number of pages4
ISBN (Electronic)9781665484947
DOIs
StatePublished - 2022
Event48th IEEE European Solid State Circuits Conference, ESSCIRC 2022 - Milan, Italy
Duration: Sep 19 2022Sep 22 2022

Publication series

NameESSCIRC 2022 - IEEE 48th European Solid State Circuits Conference, Proceedings

Conference

Conference48th IEEE European Solid State Circuits Conference, ESSCIRC 2022
Country/TerritoryItaly
CityMilan
Period9/19/229/22/22

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Artificial Intelligence

Keywords

  • 5G
  • 6G
  • IRS
  • RIS
  • beamforming
  • blockage
  • millimeter-wave
  • phased array
  • reconfigurable intelligent surface
  • reflectarray
  • terahertz
  • transmitarray

Fingerprint

Dive into the research topics of 'Reconfigurable Intelligent Surfaces Enabled by Silicon Chips for Secure and Robust mmWave and THz Wireless Communication'. Together they form a unique fingerprint.

Cite this