Rapid and minimally invasive quantum cascade wafer testing

Ekua N. Bentil, Fatima Toor, Anthony J. Hoffman, Matthew D. Escarra, Claire F. Gmachl

Research output: Contribution to journalConference article

Abstract

Quantum Cascade (QC) wafer quality testing requires intensive processing and characterization. Here, we demonstrate a minimally invasive technique that gives rapid feedback on wafer quality. A mesa is fabricated using only a single etch and metallization step. The device is electrically pumped and optically and electrically characterized. The peak wavelength position and the full width at half maximum (FWHM) as a function of applied electric field, turn-on voltage, maximum operating current density and threshold current density of the mesas are measured. Results of the mesa and lasers processed from the same wafer are compared and differed by less than 10%.

Original languageEnglish (US)
Article number72300T
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume7230
DOIs
StatePublished - Apr 6 2009
EventNovel In-Plane Semiconductor Lasers VIII - San Jose, CA, United States
Duration: Jan 26 2009Jan 29 2009

All Science Journal Classification (ASJC) codes

  • Computer Science Applications
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Applied Mathematics
  • Condensed Matter Physics

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