Radiation-hardness of VA1 with sub-micron process technology

M. Yokoyama, H. Aihara, M. Hazumi, H. Ishino, J. Kaneko, Y. Li, Daniel Robert Marlow, S. Mikkelsen, E. Nygård, H. Tajima, J. Talebi, G. Varner, H. Yamamoto

Research output: Contribution to conferencePaperpeer-review

Abstract

We have studied the radiation hardness of the VA1. a Viking-architecture preamplifier VLSI chip. LSI samples are fabricated by 0.8 μm and 0.35 μm process technology to improve radiation hardness of the LSI for the Belle silicon vertex detector upgrade. We have observed significant improvement of the radiation hardness with 0.8 μm technology. Little degradation of noise and gain is observed to total dose of 20 MRad .for the VA1 fabricated by the 0.35 μm technology. We find that the radiation hardness improves at a scaling of better than tox-6 (tox: oxide thickness). Basic parameters of MOS FETs are also studied to understand a mechanism of the radiation damage in the VA1.

Original languageEnglish (US)
StatePublished - Dec 1 2000
Event2000 IEEE Nuclear Science Symposium Conference Record - Lyon, France
Duration: Oct 15 2000Oct 20 2000

Other

Other2000 IEEE Nuclear Science Symposium Conference Record
Country/TerritoryFrance
CityLyon
Period10/15/0010/20/00

All Science Journal Classification (ASJC) codes

  • Computer Vision and Pattern Recognition
  • Industrial and Manufacturing Engineering

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