@inproceedings{762f93197c664173b23662ec49381347,
title = "Power Systems on Chiplet: Inductor-Linked Multi-Output Switched-Capacitor Multi-Rail Power Delivery on Chiplets",
abstract = "The energy demand of future computing introduces new challenges in voltage regulator design. This paper explores an inductor-linked single-input multi-output hybrid switched-capacitor power architecture with modular output cells for 48-V to point-of-load (PoL) chiplet power delivery. The unique inductor-linked configuration of switched-capacitor circuits enables high performance with a high voltage conversion ratio while achieving high efficiency and high power density. The architecture can be used, for example, to support multiple loads in a chiplet with many voltage rails from a high voltage input.",
keywords = "magnetics, packaging, power architecture, switched-capacitor, transformer, voltage regulation module (VRM)",
author = "Mian Liao and Zhou, {Daniel H.} and Ping Wang and Minjie Chen",
note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 4th International Symposium on 3D Power Electronics Integration and Manufacturing, 3D-PEIM 2023 ; Conference date: 01-02-2023 Through 03-02-2023",
year = "2023",
doi = "10.1109/3D-PEIM55914.2023.10052630",
language = "English (US)",
series = "2023 4th International Symposium on 3D Power Electronics Integration and Manufacturing, 3D-PEIM 2023",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2023 4th International Symposium on 3D Power Electronics Integration and Manufacturing, 3D-PEIM 2023",
address = "United States",
}