TY - GEN
T1 - Powder sublimation and porosity evolution in sublimation crystal growth
AU - Wang, Xiaolin
AU - Cai, Dang
AU - Zhang, Hui
PY - 2006
Y1 - 2006
N2 - In this paper, a numerical model that combines powder sublimation kinetics and porosity evolution phenomenon is presented. A driving force due to temperature difference is introduced into the aluminum nitride (A1N) powder sublimation kinetics. A new method to increase crystal growth rate by changing the powder geometry is proposed. The new method includes changing the initial powder porosity and creating a hole in the packed powder. Powder porosity evolution and growth rate variation are presented. Simulation results for the case with a central hole and without the hole are compared. The effect of the hole size is investigated. The results show that the powder sublimation rate increases with a hole, and it is also validated by experiments, Finally, the powder geometry is optimized using numerical simulations.
AB - In this paper, a numerical model that combines powder sublimation kinetics and porosity evolution phenomenon is presented. A driving force due to temperature difference is introduced into the aluminum nitride (A1N) powder sublimation kinetics. A new method to increase crystal growth rate by changing the powder geometry is proposed. The new method includes changing the initial powder porosity and creating a hole in the packed powder. Powder porosity evolution and growth rate variation are presented. Simulation results for the case with a central hole and without the hole are compared. The effect of the hole size is investigated. The results show that the powder sublimation rate increases with a hole, and it is also validated by experiments, Finally, the powder geometry is optimized using numerical simulations.
UR - https://www.scopus.com/pages/publications/33845545232
UR - https://www.scopus.com/pages/publications/33845545232#tab=citedBy
M3 - Conference contribution
AN - SCOPUS:33845545232
SN - 1563478153
SN - 9781563478154
T3 - Collection of Technical Papers - 9th AIAA/ASME Joint Thermophysics and Heat Transfer Conference Proceedings
SP - 1055
EP - 1063
BT - Collection of Technical Papers - 9th AIAA/ASME Joint Thermophysics and Heat Transfer Conference Proceedings
T2 - 9th AIAA/ASME Joint Thermophysics and Heat Transfer Conference Proceedings
Y2 - 5 June 2006 through 8 June 2006
ER -