TY - GEN
T1 - Polymer-nanocrystal nanocomposite capacitors and their applications in energy storage
AU - Lombardi, Julien
AU - Pearsall, Frederick A.
AU - Farahmand, Nasim
AU - Van Tassel, Barry
AU - Leland, Eli S.
AU - Huang, Limin
AU - Liu, Shuangyi
AU - Yang, Shyuan
AU - Le, Chengrui
AU - Kymissis, Ioannis
AU - Kinget, Peter
AU - Sanders, Seth R.
AU - Steingart, Daniel Artemus
AU - O'Brien, Stephen
N1 - Funding Information:
Funding was provided in part by the Advanced Research Project Agency for Energy (ARPA-e), ADEPT DE-AR0000114, NYSERDA and in part by the National Science Foundation under award NSF #1461499.
Publisher Copyright:
© 2018 IEEE.
PY - 2019/1/8
Y1 - 2019/1/8
N2 - Nanocomposite metal-insulator-metal (MIM) capacitors are of great interest due to the possibility of reducing the number of discrete components in printed circuit boards, and alternatively using embedded or directly printed capacitors in conjunction with integrated circuits. Flexible substrates also become candidates when employing low processing temperatures. In addition to compatibility with nanomanufacturing, the prospect of designing a nanocomposite dielectric, by combining colloidal nanoparticle fillers and polymer hosts, lends itself very well to the idea of tunability of the mechanical and electrical properties. A parallel plate capacitor is a deceptively simple device concept that quickly evolves into a complex problem when considering how components can be assembled into the dielectric layer to optimize for comprehensive performance, as a function of capacitance, frequency, voltage, leakage, dissipation loss and ESR. Our work in solution processing of inorganic oxide dielectrics and multiferroics, using a modified sol-gel approach allows for the preparation of a variety of formulations that can be treated as inks for deposition as layers and/or for the design of novel nanocomposite films.
AB - Nanocomposite metal-insulator-metal (MIM) capacitors are of great interest due to the possibility of reducing the number of discrete components in printed circuit boards, and alternatively using embedded or directly printed capacitors in conjunction with integrated circuits. Flexible substrates also become candidates when employing low processing temperatures. In addition to compatibility with nanomanufacturing, the prospect of designing a nanocomposite dielectric, by combining colloidal nanoparticle fillers and polymer hosts, lends itself very well to the idea of tunability of the mechanical and electrical properties. A parallel plate capacitor is a deceptively simple device concept that quickly evolves into a complex problem when considering how components can be assembled into the dielectric layer to optimize for comprehensive performance, as a function of capacitance, frequency, voltage, leakage, dissipation loss and ESR. Our work in solution processing of inorganic oxide dielectrics and multiferroics, using a modified sol-gel approach allows for the preparation of a variety of formulations that can be treated as inks for deposition as layers and/or for the design of novel nanocomposite films.
KW - capacitor
KW - chemical solution processing
KW - multiferroic
KW - nanocomposite
KW - nanocrystal
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U2 - 10.1109/NMDC.2018.8605917
DO - 10.1109/NMDC.2018.8605917
M3 - Conference contribution
AN - SCOPUS:85061834795
T3 - 2018 IEEE 13th Nanotechnology Materials and Devices Conference, NMDC 2018
BT - 2018 IEEE 13th Nanotechnology Materials and Devices Conference, NMDC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 13th IEEE Nanotechnology Materials and Devices Conference, NMDC 2018
Y2 - 14 October 2018 through 17 October 2018
ER -