Poly(ethynyl-p-xylylene), An advanced molecular caulk CVD polymer

Brad P. Carrow, Rex E. Murray, Benjamin W. Woods, Jay J. Senkevich

Research output: Contribution to journalConference articlepeer-review

9 Scopus citations


Poly(p-xylylene) (also known as parylene N) has previously been used to pore seal ultra-low k (≤ 2.2) (ULK) dielectrics. The parylene polymers may facilitate the integration of ULK dielectrics by: substantially improving their fracture toughness, hermetically sealing the pores, being able to use standard wet chemical cleans, and minimally impacting the observed dielectric constant, while minimally disrupting current process flow integrations. This paper introduces a new cross-linkable polymer that is deposited using thermal chemical vapor deposition (CVD) on the same tool that is used for parylene N deposition. The polymer, poly(ethynyl-p-xylylene) (parylene X), was deposited at room temperature. A series of 30 min post-deposition anneals in helium shows that the deposited material cross-linked between 200°C and 300°C with full conversion at 380°C for a ∼300 Å film. After the low molecular weight species out-gassed during anneals at 200°C, there was less than a percent weight loss to 450°C with no change in the optical constants and no optical loss. Previous work with poly(ethyl-p-xylylene) suggests that the dielectric constant of parylene X will be significantly lower than parylene N.

Original languageEnglish (US)
Article numberB2.10
Pages (from-to)189-194
Number of pages6
JournalMaterials Research Society Symposium Proceedings
StatePublished - 2005
Event2005 Materials Research Society Spring Meeting - San Francisco, CA, United States
Duration: Mar 28 2005Apr 1 2005

All Science Journal Classification (ASJC) codes

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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