Plasma Processing

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171 Scopus citations

Abstract

Law pressure, non equilibrium, weakly to partially ionized gas discharge plasmas are used for a variety of surface materials processing applications. The most extensive applications are in microelectronics manufacturing, where plasma sputtering, etching, stripping, cleaning and film deposition play key roles in this growing industry. Up to 30% of all process steps in integrated circuit manufacture involve low pressure plasmas in one way or another. The rapid pace of process and product technological change in this industry, coupled with the unique capabilities of plasma processing for extremely finely controlled surface modification, offers new opportunities to plasma scientists.

Original languageEnglish (US)
Pages (from-to)31-42
Number of pages12
JournalIEEE Transactions on Plasma Science
Volume22
Issue number1
DOIs
StatePublished - Feb 1994
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Nuclear and High Energy Physics
  • Condensed Matter Physics

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