Plasma Processing

David B. Graves

doi:10.1109/27.281547

Plasma Processing

David B. Graves

Research output: Contribution to journal › Article › peer-review

181 Scopus citations

Abstract

Law pressure, non equilibrium, weakly to partially ionized gas discharge plasmas are used for a variety of surface materials processing applications. The most extensive applications are in microelectronics manufacturing, where plasma sputtering, etching, stripping, cleaning and film deposition play key roles in this growing industry. Up to 30% of all process steps in integrated circuit manufacture involve low pressure plasmas in one way or another. The rapid pace of process and product technological change in this industry, coupled with the unique capabilities of plasma processing for extremely finely controlled surface modification, offers new opportunities to plasma scientists.

Original language	English (US)
Pages (from-to)	31-42
Number of pages	12
Journal	IEEE Transactions on Plasma Science
Volume	22
Issue number	1
DOIs	https://doi.org/10.1109/27.281547
State	Published - Feb 1994
Externally published	Yes

All Science Journal Classification (ASJC) codes

Nuclear and High Energy Physics
Condensed Matter Physics

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10.1109/27.281547

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AB - Law pressure, non equilibrium, weakly to partially ionized gas discharge plasmas are used for a variety of surface materials processing applications. The most extensive applications are in microelectronics manufacturing, where plasma sputtering, etching, stripping, cleaning and film deposition play key roles in this growing industry. Up to 30% of all process steps in integrated circuit manufacture involve low pressure plasmas in one way or another. The rapid pace of process and product technological change in this industry, coupled with the unique capabilities of plasma processing for extremely finely controlled surface modification, offers new opportunities to plasma scientists.

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Plasma Processing

Abstract

All Science Journal Classification (ASJC) codes

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