Plasma-enhanced etching and deposition

Dennis W. Hess, David B. Graves

Research output: Chapter in Book/Report/Conference proceedingChapter

7 Scopus citations


Chemical and chemical engineering principles involved in plasma-enhanced etching and deposition are reviewed. Modeling approaches to describe and predict plasma behavior are indicated, and specific examples of plasma-enhanced etching and deposition of thin-film materials of interest to the fabrication of microelectronic and optical devices are discussed.

Original languageEnglish (US)
Title of host publicationMicroelectronics Processing
Subtitle of host publicationChemical Engineering Aspects
PublisherPubl by ACS
Number of pages64
ISBN (Print)0841214751
StatePublished - 1989
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • General Engineering


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