Abstract
Recent studies show that plasma abatement is a practical alternative to thermal abatement devices for reducing fluorocarbon (FC) emissions from dielectric etch processes, with significantly lower CoO. Point-of-use (POU) plasma abatement devices attain high FC destruction and removal efficiency (DRE) with no process impacts and produce simple, low-molecular-weight, water-scrubble by-products.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 191-192, 194, 196, 198 |
| Journal | Semiconductor International |
| Volume | 23 |
| Issue number | 6 |
| State | Published - Jun 2000 |
| Externally published | Yes |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Microbiology
- Condensed Matter Physics
- Electrical and Electronic Engineering