Plasma abatement reduces PFC emission

Victor Vartanian, Laurie Beu, Tom Lii, David Graves, Eric J. Tonnis, Rusty Jewett, Bill Wofford, John Bevan, Chris Hartz, Michelle Gunn

Research output: Contribution to journalArticlepeer-review

9 Scopus citations


Recent studies show that plasma abatement is a practical alternative to thermal abatement devices for reducing fluorocarbon (FC) emissions from dielectric etch processes, with significantly lower CoO. Point-of-use (POU) plasma abatement devices attain high FC destruction and removal efficiency (DRE) with no process impacts and produce simple, low-molecular-weight, water-scrubble by-products.

Original languageEnglish (US)
Pages (from-to)191-192, 194, 196, 198
JournalSemiconductor International
Issue number6
StatePublished - Jun 2000
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Microbiology
  • Condensed Matter Physics
  • Electrical and Electronic Engineering


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