Plasma abatement reduces PFC emission

Victor Vartanian; Laurie Beu; Tom Lii; David Graves; Eric J. Tonnis; Rusty Jewett; Bill Wofford; John Bevan; Chris Hartz; Michelle Gunn

Plasma abatement reduces PFC emission

Victor Vartanian, Laurie Beu, Tom Lii, David Graves, Eric J. Tonnis, Rusty Jewett, Bill Wofford, John Bevan, Chris Hartz, Michelle Gunn

Research output: Contribution to journal › Article › peer-review

9 Scopus citations

Abstract

Recent studies show that plasma abatement is a practical alternative to thermal abatement devices for reducing fluorocarbon (FC) emissions from dielectric etch processes, with significantly lower CoO. Point-of-use (POU) plasma abatement devices attain high FC destruction and removal efficiency (DRE) with no process impacts and produce simple, low-molecular-weight, water-scrubble by-products.

Original language	English (US)
Pages (from-to)	191-192, 194, 196, 198
Journal	Semiconductor International
Volume	23
Issue number	6
State	Published - Jun 2000
Externally published	Yes

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Microbiology
Condensed Matter Physics
Electrical and Electronic Engineering

Cite this

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title = "Plasma abatement reduces PFC emission",

abstract = "Recent studies show that plasma abatement is a practical alternative to thermal abatement devices for reducing fluorocarbon (FC) emissions from dielectric etch processes, with significantly lower CoO. Point-of-use (POU) plasma abatement devices attain high FC destruction and removal efficiency (DRE) with no process impacts and produce simple, low-molecular-weight, water-scrubble by-products.",

author = "Victor Vartanian and Laurie Beu and Tom Lii and David Graves and Tonnis, {Eric J.} and Rusty Jewett and Bill Wofford and John Bevan and Chris Hartz and Michelle Gunn",

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language = "English (US)",

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T1 - Plasma abatement reduces PFC emission

AU - Vartanian, Victor

AU - Beu, Laurie

AU - Lii, Tom

AU - Graves, David

AU - Tonnis, Eric J.

AU - Jewett, Rusty

AU - Wofford, Bill

AU - Bevan, John

AU - Hartz, Chris

AU - Gunn, Michelle

PY - 2000/6

Y1 - 2000/6

N2 - Recent studies show that plasma abatement is a practical alternative to thermal abatement devices for reducing fluorocarbon (FC) emissions from dielectric etch processes, with significantly lower CoO. Point-of-use (POU) plasma abatement devices attain high FC destruction and removal efficiency (DRE) with no process impacts and produce simple, low-molecular-weight, water-scrubble by-products.

AB - Recent studies show that plasma abatement is a practical alternative to thermal abatement devices for reducing fluorocarbon (FC) emissions from dielectric etch processes, with significantly lower CoO. Point-of-use (POU) plasma abatement devices attain high FC destruction and removal efficiency (DRE) with no process impacts and produce simple, low-molecular-weight, water-scrubble by-products.

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M3 - Article

AN - SCOPUS:6744231365

SN - 0163-3767

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SP - 191-192, 194, 196, 198

JO - Semiconductor International

JF - Semiconductor International

IS - 6

ER -

Plasma abatement reduces PFC emission

Abstract

All Science Journal Classification (ASJC) codes

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