Patterning conductive copper by nanotransfer printing

Kimberly Felmet; Yueh Lin Loo; Yangming Sun

doi:10.1063/1.1803916

Patterning conductive copper by nanotransfer printing

Kimberly Felmet, Yueh Lin Loo, Yangming Sun

Research output: Contribution to journal › Article › peer-review

61 Scopus citations

Abstract

We describe a method for patterning conductive copper over large areas by nanotransfer printing (nTP). This technique is purely additive and yields feature sizes in the 1-500 μm range. Unlike gold patterns printed in a similar manner, oligomers from poly(dimethylsiloxane) (PDMS) stamps used in nTP permeate through the entire thickness of printed copper resulting in nonconductive patterns. Hot leaching the PDMS stamps in toluene prior to printing removes residual oligomers; printing with pretreated stamps reproducibly yields conductive copper patterns with an average resistivity of 31 μΩ-cm.

Original language	English (US)
Pages (from-to)	3316-3318
Number of pages	3
Journal	Applied Physics Letters
Volume	85
Issue number	15
DOIs	https://doi.org/10.1063/1.1803916
State	Published - Oct 11 2004
Externally published	Yes

All Science Journal Classification (ASJC) codes

Physics and Astronomy (miscellaneous)

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10.1063/1.1803916

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title = "Patterning conductive copper by nanotransfer printing",

abstract = "We describe a method for patterning conductive copper over large areas by nanotransfer printing (nTP). This technique is purely additive and yields feature sizes in the 1-500 μm range. Unlike gold patterns printed in a similar manner, oligomers from poly(dimethylsiloxane) (PDMS) stamps used in nTP permeate through the entire thickness of printed copper resulting in nonconductive patterns. Hot leaching the PDMS stamps in toluene prior to printing removes residual oligomers; printing with pretreated stamps reproducibly yields conductive copper patterns with an average resistivity of 31 μΩ-cm.",

author = "Kimberly Felmet and Loo, {Yueh Lin} and Yangming Sun",

note = "Funding Information: The authors gratefully acknowledge funding from the Camille & Henry Dreyfus New Faculty Award, the National Science Foundation (DMR-0314707), the Welch Foundation, and Ricoh Innovations. The author would also like to thank Dr. Franklin Kalk of DuPont Photomasks for supplying the photomasks for this project. Copyright: Copyright 2012 Elsevier B.V., All rights reserved.",

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doi = "10.1063/1.1803916",

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T1 - Patterning conductive copper by nanotransfer printing

AU - Felmet, Kimberly

AU - Loo, Yueh Lin

AU - Sun, Yangming

N1 - Funding Information: The authors gratefully acknowledge funding from the Camille & Henry Dreyfus New Faculty Award, the National Science Foundation (DMR-0314707), the Welch Foundation, and Ricoh Innovations. The author would also like to thank Dr. Franklin Kalk of DuPont Photomasks for supplying the photomasks for this project. Copyright: Copyright 2012 Elsevier B.V., All rights reserved.

PY - 2004/10/11

Y1 - 2004/10/11

N2 - We describe a method for patterning conductive copper over large areas by nanotransfer printing (nTP). This technique is purely additive and yields feature sizes in the 1-500 μm range. Unlike gold patterns printed in a similar manner, oligomers from poly(dimethylsiloxane) (PDMS) stamps used in nTP permeate through the entire thickness of printed copper resulting in nonconductive patterns. Hot leaching the PDMS stamps in toluene prior to printing removes residual oligomers; printing with pretreated stamps reproducibly yields conductive copper patterns with an average resistivity of 31 μΩ-cm.

AB - We describe a method for patterning conductive copper over large areas by nanotransfer printing (nTP). This technique is purely additive and yields feature sizes in the 1-500 μm range. Unlike gold patterns printed in a similar manner, oligomers from poly(dimethylsiloxane) (PDMS) stamps used in nTP permeate through the entire thickness of printed copper resulting in nonconductive patterns. Hot leaching the PDMS stamps in toluene prior to printing removes residual oligomers; printing with pretreated stamps reproducibly yields conductive copper patterns with an average resistivity of 31 μΩ-cm.

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Patterning conductive copper by nanotransfer printing

Abstract

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