Abstract
A chemical vapor depositable (CVD) polymeric adhesive is just not in the lexicon of science. We have recently developed a new CVD precursor 4-ethynyl[2.2]paracyclophane, which yields poly(ethynyl-p-xylylene) (parylene X) at room temperature on the parylene equipment platform. As-deposited it exists as a linear chain polymer with ethynyl pendant groups. The deposition uses no solvent, no catalysts, no initiator and is very suitable for semiconductor manufacturing. In particular it could be used as an adhesive for wafer-to-wafer bonding for the fabrication of 3-D integrated devices. The dielectric adhesive approach has the advantage of possessing low thermal diffusivity thereby blocking heat flow into sensitive memory bonded on top of high performance logic. Parylene X, presented here has adequate thermal stability (∼420 °C) and predominately cross-links between 200 °C and 300 °C, with full completion at 380 °C. These temperatures are suitable for the processing of gigascale integrated devices.
Original language | English (US) |
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Pages | 468-473 |
Number of pages | 6 |
State | Published - 2005 |
Event | 22nd International VLSI Multilevel Interconnection Conference, VMIC 2005 - Fremont, CA, United States Duration: Oct 4 2005 → Oct 6 2005 |
Other
Other | 22nd International VLSI Multilevel Interconnection Conference, VMIC 2005 |
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Country/Territory | United States |
City | Fremont, CA |
Period | 10/4/05 → 10/6/05 |
All Science Journal Classification (ASJC) codes
- Hardware and Architecture
- Electrical and Electronic Engineering