Packaging and Interconnect Considerations in Neuromorphic Photonic Accelerators

Mohammadreza Sanadgol Nezami, Thomas Ferreira De Lima, Matthew Mitchell, Shangxuan Yu, Jing Wang, Simon Bilodeau, Weipeng Zhang, Mohammed Al-Qadasi, Iman Taghavi, Alexander Tofini, Stephen Lin, Bhavin J. Shastri, Paul R. Prucnal, Lukas Chrostowski, Sudip Shekhar

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Computer Science

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Material Science