On-chip sensing and actuation methods for integrated self-healing mm-wave CMOS power amplifier

Kaushik Sengupta; Kaushik Dasgupta; Steven M. Bowers; Ali Hajimiri

doi:10.1109/MWSYM.2012.6259781

On-chip sensing and actuation methods for integrated self-healing mm-wave CMOS power amplifier

Kaushik Sengupta, Kaushik Dasgupta, Steven M. Bowers, Ali Hajimiri

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

18 Scopus citations

Abstract

This paper presents various low power, compact, low insertion-loss sensors with digitized ADC output and digitally controlled actuation methods for on-chip characterization and healing of a mm-Wave power amplifier. We demonstrate low insertion loss (0.4dB) RF sensors which measure true input and output power in presence of load variations and very low-headroom (10-30mV) DC sensors with built-in regulators and thermal sensors as methods for measuring PA efficiency. All sensor outputs are digitized by a SAR-based ADC for communication with a central digital core. The paper also presents digitally controlled combiner tuning and PA bias actuation. The circuits are implemented in 45 nm SOI CMOS and enable full on-chip digitally controlled characterization and actuation of the PA with a power overhead of less than 6%.

Original language	English (US)
Title of host publication	IMS 2012 - 2012 IEEE MTT-S International Microwave Symposium
DOIs	https://doi.org/10.1109/MWSYM.2012.6259781
State	Published - Oct 3 2012
Externally published	Yes
Event	2012 IEEE MTT-S International Microwave Symposium, IMS 2012 - Montreal, QC, Canada Duration: Jun 17 2012 → Jun 22 2012

Other

Other	2012 IEEE MTT-S International Microwave Symposium, IMS 2012
Country/Territory	Canada
City	Montreal, QC
Period	6/17/12 → 6/22/12

All Science Journal Classification (ASJC) codes

Radiation
Condensed Matter Physics
Electrical and Electronic Engineering

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10.1109/MWSYM.2012.6259781

Cite this

@inproceedings{53d6b9347e244e4594fce65a04620fee,

title = "On-chip sensing and actuation methods for integrated self-healing mm-wave CMOS power amplifier",

abstract = "This paper presents various low power, compact, low insertion-loss sensors with digitized ADC output and digitally controlled actuation methods for on-chip characterization and healing of a mm-Wave power amplifier. We demonstrate low insertion loss (0.4dB) RF sensors which measure true input and output power in presence of load variations and very low-headroom (10-30mV) DC sensors with built-in regulators and thermal sensors as methods for measuring PA efficiency. All sensor outputs are digitized by a SAR-based ADC for communication with a central digital core. The paper also presents digitally controlled combiner tuning and PA bias actuation. The circuits are implemented in 45 nm SOI CMOS and enable full on-chip digitally controlled characterization and actuation of the PA with a power overhead of less than 6%.",

author = "Kaushik Sengupta and Kaushik Dasgupta and Bowers, {Steven M.} and Ali Hajimiri",

year = "2012",

month = oct,

day = "3",

doi = "10.1109/MWSYM.2012.6259781",

language = "English (US)",

isbn = "9781467310871",

booktitle = "IMS 2012 - 2012 IEEE MTT-S International Microwave Symposium",

note = "2012 IEEE MTT-S International Microwave Symposium, IMS 2012 ; Conference date: 17-06-2012 Through 22-06-2012",

}

TY - GEN

T1 - On-chip sensing and actuation methods for integrated self-healing mm-wave CMOS power amplifier

AU - Sengupta, Kaushik

AU - Dasgupta, Kaushik

AU - Bowers, Steven M.

AU - Hajimiri, Ali

PY - 2012/10/3

Y1 - 2012/10/3

N2 - This paper presents various low power, compact, low insertion-loss sensors with digitized ADC output and digitally controlled actuation methods for on-chip characterization and healing of a mm-Wave power amplifier. We demonstrate low insertion loss (0.4dB) RF sensors which measure true input and output power in presence of load variations and very low-headroom (10-30mV) DC sensors with built-in regulators and thermal sensors as methods for measuring PA efficiency. All sensor outputs are digitized by a SAR-based ADC for communication with a central digital core. The paper also presents digitally controlled combiner tuning and PA bias actuation. The circuits are implemented in 45 nm SOI CMOS and enable full on-chip digitally controlled characterization and actuation of the PA with a power overhead of less than 6%.

AB - This paper presents various low power, compact, low insertion-loss sensors with digitized ADC output and digitally controlled actuation methods for on-chip characterization and healing of a mm-Wave power amplifier. We demonstrate low insertion loss (0.4dB) RF sensors which measure true input and output power in presence of load variations and very low-headroom (10-30mV) DC sensors with built-in regulators and thermal sensors as methods for measuring PA efficiency. All sensor outputs are digitized by a SAR-based ADC for communication with a central digital core. The paper also presents digitally controlled combiner tuning and PA bias actuation. The circuits are implemented in 45 nm SOI CMOS and enable full on-chip digitally controlled characterization and actuation of the PA with a power overhead of less than 6%.

UR - http://www.scopus.com/inward/record.url?scp=84866781882&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84866781882&partnerID=8YFLogxK

U2 - 10.1109/MWSYM.2012.6259781

DO - 10.1109/MWSYM.2012.6259781

M3 - Conference contribution

AN - SCOPUS:84866781882

SN - 9781467310871

BT - IMS 2012 - 2012 IEEE MTT-S International Microwave Symposium

T2 - 2012 IEEE MTT-S International Microwave Symposium, IMS 2012

Y2 - 17 June 2012 through 22 June 2012

ER -

On-chip sensing and actuation methods for integrated self-healing mm-wave CMOS power amplifier

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