TY - JOUR
T1 - Nanoscale evolution of interface morphology during electrodeposition
AU - Schneider, Nicholas M.
AU - Park, Jeung Hun
AU - Grogan, Joseph M.
AU - Steingart, Daniel Artemus
AU - Bau, Haim H.
AU - Ross, Frances M.
N1 - Funding Information:
The authors acknowledge funding, in part, from NSF grants 1129722, 1066573, 1031208, 1310639, and 1402872 and the BP Carbon Mitigation Initiative. Microscopy was performed at the IBM T.J. Watson Research Center with the valuable experimental contributions of Dr. Mark C. Reuter and Mr. Arthur Ellis of IBM. The authors would like to thank Prof. Dale Barkey of the University of New Hampshire and Prof. David Srolovitz of Princeton for useful discussions, Dr. Shoham Bhadri of Princeton for assistance with Pb-containing solutions, and Dr. Mike Norton for assistance with figure graphics.
Publisher Copyright:
© 2017 The Author(s).
PY - 2017/12/1
Y1 - 2017/12/1
N2 - Control of interfacial morphology in electrochemical processes is essential for applications ranging from nanomanufacturing to batteries. Here, we quantify the evolution of an electrochemical growth front, using liquid cell electron microscopy to access unexplored length and time scales. During galvanostatic deposition of copper from an acidic electrolyte, we find that the growth front initially evolves consistent with kinetic roughening theory. Subsequently, it roughens more rapidly, consistent with diffusion-limited growth physics. However, the onset of roughening is strongly delayed compared to expectations, suggesting the importance of lateral diffusion of ions. Based on these growth regimes, we discuss morphological control and demonstrate the effects of two strategies, pulse plating and the use of electrolyte additives.
AB - Control of interfacial morphology in electrochemical processes is essential for applications ranging from nanomanufacturing to batteries. Here, we quantify the evolution of an electrochemical growth front, using liquid cell electron microscopy to access unexplored length and time scales. During galvanostatic deposition of copper from an acidic electrolyte, we find that the growth front initially evolves consistent with kinetic roughening theory. Subsequently, it roughens more rapidly, consistent with diffusion-limited growth physics. However, the onset of roughening is strongly delayed compared to expectations, suggesting the importance of lateral diffusion of ions. Based on these growth regimes, we discuss morphological control and demonstrate the effects of two strategies, pulse plating and the use of electrolyte additives.
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U2 - 10.1038/s41467-017-02364-9
DO - 10.1038/s41467-017-02364-9
M3 - Article
C2 - 29259183
AN - SCOPUS:85038637070
SN - 2041-1723
VL - 8
JO - Nature communications
JF - Nature communications
IS - 1
M1 - 2174
ER -