Abstract
Nanocomposites are of great interest to electronic packaging, and the opportunities are readily comprehended. First is the ability to integrate materials cheaply, with better performance, miniaturization, and reliability for a wide range of applications, including embedded passives (capacitors, resistors), low-k materials, adhesives (electrically conductive adhesives), interconnects, and thermal interface materials [1].
| Original language | English (US) |
|---|---|
| Article number | 8576994 |
| Pages (from-to) | 8-17 |
| Number of pages | 10 |
| Journal | IEEE Nanotechnology Magazine |
| Volume | 13 |
| Issue number | 1 |
| DOIs | |
| State | Published - Feb 2019 |
All Science Journal Classification (ASJC) codes
- Mechanical Engineering
- Electrical and Electronic Engineering
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