TY - JOUR
T1 - Nanocomposite capacitors in power electronics and multiferroics
T2 - Prospects for the future of nanopackaging and beyond
AU - Leland, Eli S.
AU - Kinget, Peter R.
AU - Kymissis, Ioannis
AU - Steingart, Daniel Artemus
AU - Sanders, Seth R.
AU - O'Brien, Stephen
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/2
Y1 - 2019/2
N2 - Nanocomposites are of great interest to electronic packaging, and the opportunities are readily comprehended. First is the ability to integrate materials cheaply, with better performance, miniaturization, and reliability for a wide range of applications, including embedded passives (capacitors, resistors), low-k materials, adhesives (electrically conductive adhesives), interconnects, and thermal interface materials [1].
AB - Nanocomposites are of great interest to electronic packaging, and the opportunities are readily comprehended. First is the ability to integrate materials cheaply, with better performance, miniaturization, and reliability for a wide range of applications, including embedded passives (capacitors, resistors), low-k materials, adhesives (electrically conductive adhesives), interconnects, and thermal interface materials [1].
UR - http://www.scopus.com/inward/record.url?scp=85058883528&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85058883528&partnerID=8YFLogxK
U2 - 10.1109/MNANO.2018.2881331
DO - 10.1109/MNANO.2018.2881331
M3 - Article
AN - SCOPUS:85058883528
SN - 1932-4510
VL - 13
SP - 8
EP - 17
JO - IEEE Nanotechnology Magazine
JF - IEEE Nanotechnology Magazine
IS - 1
M1 - 8576994
ER -