Nanocomposite capacitors in power electronics and multiferroics: Prospects for the future of nanopackaging and beyond

Eli S. Leland, Peter R. Kinget, Ioannis Kymissis, Daniel Artemus Steingart, Seth R. Sanders, Stephen O'Brien

Research output: Contribution to journalArticle

2 Scopus citations

Abstract

Nanocomposites are of great interest to electronic packaging, and the opportunities are readily comprehended. First is the ability to integrate materials cheaply, with better performance, miniaturization, and reliability for a wide range of applications, including embedded passives (capacitors, resistors), low-k materials, adhesives (electrically conductive adhesives), interconnects, and thermal interface materials [1].

Original languageEnglish (US)
Article number8576994
Pages (from-to)8-17
Number of pages10
JournalIEEE Nanotechnology Magazine
Volume13
Issue number1
DOIs
StatePublished - Feb 2019

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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    Leland, E. S., Kinget, P. R., Kymissis, I., Steingart, D. A., Sanders, S. R., & O'Brien, S. (2019). Nanocomposite capacitors in power electronics and multiferroics: Prospects for the future of nanopackaging and beyond. IEEE Nanotechnology Magazine, 13(1), 8-17. [8576994]. https://doi.org/10.1109/MNANO.2018.2881331