Nanocomposites are of great interest to electronic packaging, and the opportunities are readily comprehended. First is the ability to integrate materials cheaply, with better performance, miniaturization, and reliability for a wide range of applications, including embedded passives (capacitors, resistors), low-k materials, adhesives (electrically conductive adhesives), interconnects, and thermal interface materials .
All Science Journal Classification (ASJC) codes
- Mechanical Engineering
- Electrical and Electronic Engineering