Molecular Caulk: Enabling aspects for ultra-low κ dielectric integration

Jay J. Senkevich, Brad P. Carrow, Benjamin W. Woods, Dae Lok Bae, Timothy S. Cale, Pei I. Wang

Research output: Contribution to journalConference articlepeer-review

2 Scopus citations


Integration issues have plagued the introduction of ultra-low κ dielectrics. It was hoped that the same processes developed for low k dielectrics could be transferred to their porous analogues. This has not been the case since porosity adds challenges of mechanical robustness of the dielectric as well as metallization issues. Molecular Caulk, initially developed with the chemical vapor depositable parylene N, has addressed many these issues. In particular it fracture toughens the porous dielectric while hermetically sealing the surface of the vulnerable dielectric to moisture as well as wet chemical agents such as TMAH. A new robust material, parylene X, is a cross-linkable hydrocarbon chemistry that has all the benefits of parylene N (fracture toughness improvement, low dielectric constant, pore sealing, selectivity, etc...) but has improved thermal stability, does not readily crystallize and therefore has reduced anisotropy, and potentially superior mechanical properties.

Original languageEnglish (US)
Pages (from-to)375-379
Number of pages5
JournalAdvanced Metallization Conference (AMC)
StatePublished - Mar 23 2006
Externally publishedYes
Event22nd Annual Advanced Metallization Conference, AMC 2005 - Colorado, Springs, CO, United States
Duration: Sep 27 2005Sep 29 2005

All Science Journal Classification (ASJC) codes

  • General Chemical Engineering


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