Layer-by-layer assembly of two-dimensional materials into wafer-scale heterostructures

Kibum Kang, Kan Heng Lee, Yimo Han, Hui Gao, Saien Xie, David A. Muller, Jiwoong Park

Research output: Contribution to journalArticlepeer-review

470 Scopus citations

Fingerprint

Dive into the research topics of 'Layer-by-layer assembly of two-dimensional materials into wafer-scale heterostructures'. Together they form a unique fingerprint.

Material Science

Keyphrases

Engineering