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Layer-by-layer assembly of two-dimensional materials into wafer-scale heterostructures
Kibum Kang
, Kan Heng Lee
, Yimo Han
, Hui Gao
,
Saien Xie
, David A. Muller
, Jiwoong Park
Research output
:
Contribution to journal
›
Article
›
peer-review
549
Scopus citations
Overview
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Material Science
Film
100%
Heterojunction
100%
Two-Dimensional Material
100%
Physical Property
14%
Superlattice
14%
Graphene
14%
Transition Metal Dichalcogenide
14%
Novel Material
14%
Keyphrases
Layer-by-layer Assembly
100%
Stacked Film
25%
Superlattice Films
25%
Layer-by-layer Assembly Technique
25%
Ultrathin Membrane
25%
Large-scale Assembly
25%
Interlayer Interface
25%
Heterostructure Film
25%
Vertical Properties
25%
Tunneling Devices
25%
Engineering
Band-Engineered
25%
Plastic Surface
25%