LAVA: Fine-grained 3D indoor wireless coverage for small IoT devices

R. Ivan Zelaya, William Sussman, Jeremy Gummeson, Kyle Jamieson, Wenjun Hu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Scopus citations

Abstract

Small IoT devices deployed in challenging locations suffer from uneven 3D coverage in complex environments. This work optimizes indoor coverage with LAVA, a Large Array of Vanilla Amplifiers. LAVA is a standard-agnostic cooperative mesh of elements, i.e., RF devices each consisting of several switched input and output antennas connected to fixed-gain amplifiers. Each LAVA element is further equipped with rudimentary power sensing to detect nearby transmissions. The elements report power readings to the LAVA control plane, which then infers active link sessions without explicitly interacting with the endpoint transmitter or receiver. With simple on-off control of amplifiers and antenna switching, LAVA boosts passing signals via multi hop amplify-and-forward. LAVA explores a middle ground between smart surfaces and physical-layer relays. Multi-hopping over short inter-hop distances exerts more control over the end-to-end trajectory, supporting fine-grained coverage and spatial reuse. Ceiling testbed results show throughput improvements to individual Wi-Fi links by 50% on average and up to 100% at 15 dBm transmit power (193% on average, up to 8x at 0 dBm). ZigBee links see up to 17 dB power gain. For pairs of co-channel concurrent links, LAVA provides average per-link throughput improvements of 517% at 0 dBm and 80% at 15 dBm.

Original languageEnglish (US)
Title of host publicationSIGCOMM 2021 - Proceedings of the ACM SIGCOMM 2021 Conference
PublisherAssociation for Computing Machinery, Inc
Pages123-136
Number of pages14
ISBN (Electronic)9781450383837
DOIs
StatePublished - Aug 9 2021
Externally publishedYes
Event2021 Annual Conference of the ACM Special Interest Group on Data Communication on the Applications, SIGCOMM 2021 - Virtual, Online, United States
Duration: Aug 23 2021Aug 27 2021

Publication series

NameSIGCOMM 2021 - Proceedings of the ACM SIGCOMM 2021 Conference

Conference

Conference2021 Annual Conference of the ACM Special Interest Group on Data Communication on the Applications, SIGCOMM 2021
Country/TerritoryUnited States
CityVirtual, Online
Period8/23/218/27/21

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Hardware and Architecture
  • Electrical and Electronic Engineering

Keywords

  • multi-hop amplify-and-forward
  • non-uniform 3D coverage
  • programmable radio environments
  • smart surfaces

Fingerprint

Dive into the research topics of 'LAVA: Fine-grained 3D indoor wireless coverage for small IoT devices'. Together they form a unique fingerprint.

Cite this