TY - JOUR
T1 - Large-scale sensing system combining large-area electronics and cmos ics for structural-health monitoring
AU - Hu, Yingzhe
AU - Rieutort-Louis, Warren S.A.
AU - Sanz-Robinson, Josue
AU - Huang, Liechao
AU - Glisic, Branko
AU - Sturm, James C.
AU - Wagner, Sigurd
AU - Verma, Naveen
PY - 2014/2
Y1 - 2014/2
N2 - Early-stage damage detection for bridges requires continuously sensing strain over large portions of the structure, yet with centimeter-scale resolution. To achieve sensing on such a scale, this work presents a sensing sheet that combines CMOS ICs, for sensor control and readout, with large-area electronics (LAE), for many-channel distributed sensing and data aggregation. Bonded to a structure, the sheet thus enables strain sensing scalable to high spatial resolutions. In order to combine the two technologies in a correspondingly scalable manner, non-contact interfaces are used. Inductive and capacitive antennas are patterned on the LAE sheet and on the IC packages, so that system assembly is achieved via low-cost sheet lamination without metallurgical bonds. The LAE sheet integrates thin-film strain gauges, thin-film transistors, and long interconnects on a 50-μm-thick polyimide sheet, and the CMOS ICs integrate subsystems for sensor readout, control, and communication over the distributed sheet in a 130 nm process. Multi-channel strain readout is achieved with sensitivity of 18 μStrainRMS at a readout energy of 270 nJ/measurement, while the communication energy is 12.8 pJ/3.3 pJ per bit (Tx/Rx) over a distance of 7.5 m.
AB - Early-stage damage detection for bridges requires continuously sensing strain over large portions of the structure, yet with centimeter-scale resolution. To achieve sensing on such a scale, this work presents a sensing sheet that combines CMOS ICs, for sensor control and readout, with large-area electronics (LAE), for many-channel distributed sensing and data aggregation. Bonded to a structure, the sheet thus enables strain sensing scalable to high spatial resolutions. In order to combine the two technologies in a correspondingly scalable manner, non-contact interfaces are used. Inductive and capacitive antennas are patterned on the LAE sheet and on the IC packages, so that system assembly is achieved via low-cost sheet lamination without metallurgical bonds. The LAE sheet integrates thin-film strain gauges, thin-film transistors, and long interconnects on a 50-μm-thick polyimide sheet, and the CMOS ICs integrate subsystems for sensor readout, control, and communication over the distributed sheet in a 130 nm process. Multi-channel strain readout is achieved with sensitivity of 18 μStrainRMS at a readout energy of 270 nJ/measurement, while the communication energy is 12.8 pJ/3.3 pJ per bit (Tx/Rx) over a distance of 7.5 m.
KW - Choppers (circuits)
KW - coupled circuits
KW - flexible electronics
KW - sensors
KW - thin-film transistors
UR - http://www.scopus.com/inward/record.url?scp=84893865848&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84893865848&partnerID=8YFLogxK
U2 - 10.1109/JSSC.2013.2295979
DO - 10.1109/JSSC.2013.2295979
M3 - Article
AN - SCOPUS:84893865848
SN - 0018-9200
VL - 49
SP - 513
EP - 523
JO - IEEE Journal of Solid-State Circuits
JF - IEEE Journal of Solid-State Circuits
IS - 2
M1 - 6709767
ER -