Large-grain polycrystalline silicon films with low intragranular defect density by low-temperature solid-phase crystallization without underlying oxide

Xiang Zheng Bo, Nan Yao, Sean R. Shieh, Thomas S. Duffy, J. C. Sturm

Research output: Contribution to journalArticle

41 Scopus citations

Abstract

The solid-phase crystallization of an amorphous silicon film to polycrystalline silicon by a low-temperature (≤600°C) furnace anneal has been investigated in a suspended cantilever structure without underlying silicon oxide by transmission electron microscopy and Raman spectroscopy. The grain size of polysilicon increases up to ∼3.0 μm and the density of intragranular defects decreases one order of magnitude in the samples without underlying oxide, compared with those with underlying oxide. The main reasons for the high quality of the suspended structures are thought to be due to the lower stress in the films during crystallization and a reduced grain nucleation rate.

Original languageEnglish (US)
Pages (from-to)2910-2915
Number of pages6
JournalJournal of Applied Physics
Volume91
Issue number5
DOIs
StatePublished - Feb 15 2002

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy(all)

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