TY - GEN
T1 - Large-area electronics combined with integrated circuits into a strain sensing sheets
AU - Yao, Yao
AU - Tung, Shue Ting
AU - Verma, Naveen
AU - Wagner, Sigurd
AU - Sturm, James
AU - Glisic, Branko
PY - 2015
Y1 - 2015
N2 - The strain sensing sheet based on Large Area Electronics (LAE) and Integrated Circuits (ICs) is being researched and developed at Princeton University. The prototypes of components of the sensing sheet including LAE interconnect, embedded sensors, batteries, and power harvesters have been created. Behaviour of the sensor exposed to damage has been studied and characterized. Probabilistic algorithms have been created for both data interpretation and evaluation of probability of detection. Small-scale and large-scale tests have been successfully carried out in order to evaluate the concept of the strain sensing sheet and understand its behavior under conditions of damage occurrence and propagation. The concept of the strain sensing sheet, test results, and its current state of advancement are presented in this paper.
AB - The strain sensing sheet based on Large Area Electronics (LAE) and Integrated Circuits (ICs) is being researched and developed at Princeton University. The prototypes of components of the sensing sheet including LAE interconnect, embedded sensors, batteries, and power harvesters have been created. Behaviour of the sensor exposed to damage has been studied and characterized. Probabilistic algorithms have been created for both data interpretation and evaluation of probability of detection. Small-scale and large-scale tests have been successfully carried out in order to evaluate the concept of the strain sensing sheet and understand its behavior under conditions of damage occurrence and propagation. The concept of the strain sensing sheet, test results, and its current state of advancement are presented in this paper.
KW - Damage detection and localization
KW - Direct sensing
KW - Fatigue crack
KW - Large Area Electronics (LAE)
KW - Strain sensing sheet
KW - Structural health monitoring (SHM)
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M3 - Conference contribution
AN - SCOPUS:84971280939
T3 - IABSE Conference, Geneva 2015: Structural Engineering: Providing Solutions to Global Challenges - Report
SP - 1287
EP - 1294
BT - IABSE Conference, Geneva 2015
PB - International Association for Bridge and Structural Engineering (IABSE)
T2 - IABSE Conference, Geneva 2015: Structural Engineering: Providing Solutions to Global Challenges
Y2 - 23 September 2015 through 25 September 2015
ER -