Large-area electronics combined with integrated circuits into a strain sensing sheets

Yao Yao, Shue Ting Tung, Naveen Verma, Sigurd Wagner, James Sturm, Branko Glisic

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The strain sensing sheet based on Large Area Electronics (LAE) and Integrated Circuits (ICs) is being researched and developed at Princeton University. The prototypes of components of the sensing sheet including LAE interconnect, embedded sensors, batteries, and power harvesters have been created. Behaviour of the sensor exposed to damage has been studied and characterized. Probabilistic algorithms have been created for both data interpretation and evaluation of probability of detection. Small-scale and large-scale tests have been successfully carried out in order to evaluate the concept of the strain sensing sheet and understand its behavior under conditions of damage occurrence and propagation. The concept of the strain sensing sheet, test results, and its current state of advancement are presented in this paper.

Original languageEnglish (US)
Title of host publicationIABSE Conference, Geneva 2015
Subtitle of host publicationStructural Engineering: Providing Solutions to Global Challenges - Report
PublisherInternational Association for Bridge and Structural Engineering (IABSE)
Pages1287-1294
Number of pages8
ISBN (Electronic)9783857481406
StatePublished - Jan 1 2015
EventIABSE Conference, Geneva 2015: Structural Engineering: Providing Solutions to Global Challenges - Geneva, Switzerland
Duration: Sep 23 2015Sep 25 2015

Publication series

NameIABSE Conference, Geneva 2015: Structural Engineering: Providing Solutions to Global Challenges - Report

Other

OtherIABSE Conference, Geneva 2015: Structural Engineering: Providing Solutions to Global Challenges
CountrySwitzerland
CityGeneva
Period9/23/159/25/15

All Science Journal Classification (ASJC) codes

  • Civil and Structural Engineering
  • Building and Construction

Keywords

  • Damage detection and localization
  • Direct sensing
  • Fatigue crack
  • Large Area Electronics (LAE)
  • Strain sensing sheet
  • Structural health monitoring (SHM)

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  • Cite this

    Yao, Y., Tung, S. T., Verma, N., Wagner, S., Sturm, J., & Glisic, B. (2015). Large-area electronics combined with integrated circuits into a strain sensing sheets. In IABSE Conference, Geneva 2015: Structural Engineering: Providing Solutions to Global Challenges - Report (pp. 1287-1294). (IABSE Conference, Geneva 2015: Structural Engineering: Providing Solutions to Global Challenges - Report). International Association for Bridge and Structural Engineering (IABSE).