Investigation of a chemically derivatized copper-polyimide interface

P. P. Parekh; K. E. Gonsalves; R. Holland; A. Bocarsly; G. Arbuckle

Investigation of a chemically derivatized copper-polyimide interface

P. P. Parekh, K. E. Gonsalves, R. Holland, A. Bocarsly, G. Arbuckle

Research output: Contribution to conference › Paper › peer-review

Abstract

Chemical modification of copper surfaces was achieved through derivatization by K₃Fe(CN)₆ followed by dipping in Ca(NO₃)₂. This resulted in the formation of M_x[Cu(II) (NC)Fe (II/III) (CN)₅] at the surface, Polyimide films were spin coated onto this modified copper surfaces and subsequently cured. A study of the processes/reactions occuring at the polyimide-copper interface has been attempted using XPS, SEM-EDX, Photoacoustic and FTIR spectroscopy. The consequent effects on adhesion of the polyimide film onto the modified copper substrate are sought to be elucidated by these studies.

Original language	English (US)
Pages	157
Number of pages	1
State	Published - 1988
Externally published	Yes
Event	Proceedings/Abstracts of Third International Conference on Polyimides - Ellenville, NY, USA Duration: Nov 2 1988 → Nov 4 1988

Other

Other	Proceedings/Abstracts of Third International Conference on Polyimides
City	Ellenville, NY, USA
Period	11/2/88 → 11/4/88

All Science Journal Classification (ASJC) codes

General Engineering

Cite this

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title = "Investigation of a chemically derivatized copper-polyimide interface",

abstract = "Chemical modification of copper surfaces was achieved through derivatization by K3Fe(CN)6 followed by dipping in Ca(NO3)2. This resulted in the formation of Mx[Cu(II) (NC)Fe (II/III) (CN)5] at the surface, Polyimide films were spin coated onto this modified copper surfaces and subsequently cured. A study of the processes/reactions occuring at the polyimide-copper interface has been attempted using XPS, SEM-EDX, Photoacoustic and FTIR spectroscopy. The consequent effects on adhesion of the polyimide film onto the modified copper substrate are sought to be elucidated by these studies.",

author = "Parekh, \{P. P.\} and Gonsalves, \{K. E.\} and R. Holland and A. Bocarsly and G. Arbuckle",

year = "1988",

language = "English (US)",

pages = "157",

note = "Proceedings/Abstracts of Third International Conference on Polyimides ; Conference date: 02-11-1988 Through 04-11-1988",

}

TY - CONF

T1 - Investigation of a chemically derivatized copper-polyimide interface

AU - Parekh, P. P.

AU - Gonsalves, K. E.

AU - Holland, R.

AU - Bocarsly, A.

AU - Arbuckle, G.

PY - 1988

Y1 - 1988

N2 - Chemical modification of copper surfaces was achieved through derivatization by K3Fe(CN)6 followed by dipping in Ca(NO3)2. This resulted in the formation of Mx[Cu(II) (NC)Fe (II/III) (CN)5] at the surface, Polyimide films were spin coated onto this modified copper surfaces and subsequently cured. A study of the processes/reactions occuring at the polyimide-copper interface has been attempted using XPS, SEM-EDX, Photoacoustic and FTIR spectroscopy. The consequent effects on adhesion of the polyimide film onto the modified copper substrate are sought to be elucidated by these studies.

AB - Chemical modification of copper surfaces was achieved through derivatization by K3Fe(CN)6 followed by dipping in Ca(NO3)2. This resulted in the formation of Mx[Cu(II) (NC)Fe (II/III) (CN)5] at the surface, Polyimide films were spin coated onto this modified copper surfaces and subsequently cured. A study of the processes/reactions occuring at the polyimide-copper interface has been attempted using XPS, SEM-EDX, Photoacoustic and FTIR spectroscopy. The consequent effects on adhesion of the polyimide film onto the modified copper substrate are sought to be elucidated by these studies.

UR - https://www.scopus.com/pages/publications/0024167189

UR - https://www.scopus.com/inward/citedby.url?scp=0024167189&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:0024167189

SP - 157

T2 - Proceedings/Abstracts of Third International Conference on Polyimides

Y2 - 2 November 1988 through 4 November 1988

ER -

Investigation of a chemically derivatized copper-polyimide interface

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All Science Journal Classification (ASJC) codes

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