Investigation of a chemically derivatized copper-polyimide interface

K. Gonsalves, P. Parekh, R. Holland, A. Bocarsly, G. Arbuckle

Research output: Contribution to journalConference articlepeer-review


The authors have attempted the chemical modification of copper surfaces and studied the ensuing interaction of the modified substrates with thin polyimide films. Simultaneously, these interactions have been correlated with effects on adhesion between the PI and the modified copper substrates.

Original languageEnglish (US)
Pages (from-to)106-110
Number of pages5
JournalPolymeric Materials Science and Engineering, Proceedings of the ACS Division of Polymeric Materials Science and Engineering
StatePublished - 1989
Externally publishedYes
EventProceedings of the ACS Division of Polymeric Materials: Science and Engineering - Miami Beach, FL, USA
Duration: Sep 11 1989Sep 18 1989

All Science Journal Classification (ASJC) codes

  • Chemical Engineering (miscellaneous)
  • Polymers and Plastics


Dive into the research topics of 'Investigation of a chemically derivatized copper-polyimide interface'. Together they form a unique fingerprint.

Cite this