Investigation of a chemically derivatized copper-polyimide interface

K. Gonsalves, P. Parekh, R. Holland, Andrew Bruce Bocarsly, G. Arbuckle

Research output: Contribution to journalArticle

Abstract

The authors have attempted the chemical modification of copper surfaces and studied the ensuing interaction of the modified substrates with thin polyimide films. Simultaneously, these interactions have been correlated with effects on adhesion between the PI and the modified copper substrates.

Original languageEnglish (US)
Pages (from-to)106-110
Number of pages5
JournalPolymeric Materials Science and Engineering, Proceedings of the ACS Division of Polymeric Materials Science and Engineering
Volume61
StatePublished - Dec 1 1989
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Chemical Engineering (miscellaneous)
  • Polymers and Plastics

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