The authors have attempted the chemical modification of copper surfaces and studied the ensuing interaction of the modified substrates with thin polyimide films. Simultaneously, these interactions have been correlated with effects on adhesion between the PI and the modified copper substrates.
|Original language||English (US)|
|Number of pages||5|
|Journal||Polymeric Materials Science and Engineering, Proceedings of the ACS Division of Polymeric Materials Science and Engineering|
|State||Published - Dec 1 1989|
All Science Journal Classification (ASJC) codes
- Chemical Engineering (miscellaneous)
- Polymers and Plastics