Investigation of a chemically derivatized copper-polyimide interface

K. Gonsalves; P. Parekh; R. Holland; Andrew Bruce Bocarsly; G. Arbuckle

Investigation of a chemically derivatized copper-polyimide interface

K. Gonsalves, P. Parekh, R. Holland, Andrew Bruce Bocarsly, G. Arbuckle

Research output: Contribution to journal › Article › peer-review

Abstract

The authors have attempted the chemical modification of copper surfaces and studied the ensuing interaction of the modified substrates with thin polyimide films. Simultaneously, these interactions have been correlated with effects on adhesion between the PI and the modified copper substrates.

Original language	English (US)
Pages (from-to)	106-110
Number of pages	5
Journal	Polymeric Materials Science and Engineering, Proceedings of the ACS Division of Polymeric Materials Science and Engineering
Volume	61
State	Published - Dec 1 1989
Externally published	Yes

All Science Journal Classification (ASJC) codes

Chemical Engineering (miscellaneous)
Polymers and Plastics

Cite this

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title = "Investigation of a chemically derivatized copper-polyimide interface",

abstract = "The authors have attempted the chemical modification of copper surfaces and studied the ensuing interaction of the modified substrates with thin polyimide films. Simultaneously, these interactions have been correlated with effects on adhesion between the PI and the modified copper substrates.",

author = "K. Gonsalves and P. Parekh and R. Holland and Bocarsly, {Andrew Bruce} and G. Arbuckle",

year = "1989",

month = dec,

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T1 - Investigation of a chemically derivatized copper-polyimide interface

AU - Gonsalves, K.

AU - Parekh, P.

AU - Holland, R.

AU - Bocarsly, Andrew Bruce

AU - Arbuckle, G.

PY - 1989/12/1

Y1 - 1989/12/1

N2 - The authors have attempted the chemical modification of copper surfaces and studied the ensuing interaction of the modified substrates with thin polyimide films. Simultaneously, these interactions have been correlated with effects on adhesion between the PI and the modified copper substrates.

AB - The authors have attempted the chemical modification of copper surfaces and studied the ensuing interaction of the modified substrates with thin polyimide films. Simultaneously, these interactions have been correlated with effects on adhesion between the PI and the modified copper substrates.

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M3 - Article

AN - SCOPUS:0024908253

SN - 0743-0515

VL - 61

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JO - Polymeric Materials Science and Engineering, Proceedings of the ACS Division of Polymeric Materials Science and Engineering

JF - Polymeric Materials Science and Engineering, Proceedings of the ACS Division of Polymeric Materials Science and Engineering

ER -

Investigation of a chemically derivatized copper-polyimide interface

Abstract

All Science Journal Classification (ASJC) codes

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