Investigation of a chemically derivatized copper-polyimide interface

P. P. Parekh, K. E. Gonsalves, R. Holland, A. Bocarsly, G. Arbuckle

Research output: Contribution to conferencePaper

Abstract

Chemical modification of copper surfaces was achieved through derivatization by K3Fe(CN)6 followed by dipping in Ca(NO3)2. This resulted in the formation of Mx[Cu(II) (NC)Fe (II/III) (CN)5] at the surface, Polyimide films were spin coated onto this modified copper surfaces and subsequently cured. A study of the processes/reactions occuring at the polyimide-copper interface has been attempted using XPS, SEM-EDX, Photoacoustic and FTIR spectroscopy. The consequent effects on adhesion of the polyimide film onto the modified copper substrate are sought to be elucidated by these studies.

Original languageEnglish (US)
Number of pages1
StatePublished - Dec 1 1988
Externally publishedYes
EventProceedings/Abstracts of Third International Conference on Polyimides - Ellenville, NY, USA
Duration: Nov 2 1988Nov 4 1988

Other

OtherProceedings/Abstracts of Third International Conference on Polyimides
CityEllenville, NY, USA
Period11/2/8811/4/88

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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  • Cite this

    Parekh, P. P., Gonsalves, K. E., Holland, R., Bocarsly, A., & Arbuckle, G. (1988). Investigation of a chemically derivatized copper-polyimide interface. Paper presented at Proceedings/Abstracts of Third International Conference on Polyimides, Ellenville, NY, USA, .