Abstract
Chemical modification of copper surfaces was achieved through derivatization by K3Fe(CN)6 followed by dipping in Ca(NO3)2. This resulted in the formation of Mx[Cu(II) (NC)Fe (II/III) (CN)5] at the surface, Polyimide films were spin coated onto this modified copper surfaces and subsequently cured. A study of the processes/reactions occuring at the polyimide-copper interface has been attempted using XPS, SEM-EDX, Photoacoustic and FTIR spectroscopy. The consequent effects on adhesion of the polyimide film onto the modified copper substrate are sought to be elucidated by these studies.
Original language | English (US) |
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Pages | 157 |
Number of pages | 1 |
State | Published - 1988 |
Externally published | Yes |
Event | Proceedings/Abstracts of Third International Conference on Polyimides - Ellenville, NY, USA Duration: Nov 2 1988 → Nov 4 1988 |
Other
Other | Proceedings/Abstracts of Third International Conference on Polyimides |
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City | Ellenville, NY, USA |
Period | 11/2/88 → 11/4/88 |
All Science Journal Classification (ASJC) codes
- General Engineering