Integrating and Interfacing Flexible Electronics in Hybrid Large-Area Systems

Warren S.A. Rieutort-Louis, Josue Sanz-Robinson, Tiffany Moy, Liechao Huang, Yingzhe Hu, Yasmin Afsar, James C. Sturm, Naveen Verma, Sigurd Wagner

Research output: Contribution to journalArticlepeer-review

15 Scopus citations


An approach to creating large-area systems is described that combines flexible thin-film electronic sensor surfaces with complementary metal-oxide-semi-conductor (CMOS) integrated circuits (ICs). Complete systems are built by lamination of multiple layers, consisting of thin-film subsystems and CMOS ICs on a passive flexible substrate. A flexible passive backplane provides in-plane interconnections. Via-type interconnections between stacked layers are made by inductive or capacitive coupling. Steps and testing techniques, from devices and circuits to fully integrated hybrid systems, are illustrated.

Original languageEnglish (US)
Article number7163342
Pages (from-to)1219-1229
Number of pages11
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Issue number9
StatePublished - Sep 1 2015

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering


  • Flexible electronics
  • integration
  • noncontact
  • systems
  • thin film
  • wireless


Dive into the research topics of 'Integrating and Interfacing Flexible Electronics in Hybrid Large-Area Systems'. Together they form a unique fingerprint.

Cite this