Abstract
An approach to creating large-area systems is described that combines flexible thin-film electronic sensor surfaces with complementary metal-oxide-semi-conductor (CMOS) integrated circuits (ICs). Complete systems are built by lamination of multiple layers, consisting of thin-film subsystems and CMOS ICs on a passive flexible substrate. A flexible passive backplane provides in-plane interconnections. Via-type interconnections between stacked layers are made by inductive or capacitive coupling. Steps and testing techniques, from devices and circuits to fully integrated hybrid systems, are illustrated.
Original language | English (US) |
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Article number | 7163342 |
Pages (from-to) | 1219-1229 |
Number of pages | 11 |
Journal | IEEE Transactions on Components, Packaging and Manufacturing Technology |
Volume | 5 |
Issue number | 9 |
DOIs | |
State | Published - Sep 1 2015 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering
Keywords
- Flexible electronics
- integration
- noncontact
- systems
- thin film
- wireless