A new optical interconnect technique is demonstrated for optical communication to a VLSI chip which is suitable for very high packing densities. This interconnect features small size (less than 10 microns), reproducible and accurate alignment between the optical fiber and the electronic device, and mechanically stable, high efficiency coupling.
|Original language||English (US)|
|Title of host publication||Unknown Host Publication Title|
|Publisher||Istituto Int delle Comunicazioni|
|Number of pages||2|
|State||Published - Dec 1 1985|
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